As the semiconductor industry marches towards 22 nm technology and beyond, circuit design has become unprecedentedly omplicated. This presents many new challenges for EDA (electronic design automation), such as lack of effective tools for analog circuit or high-volume and high-frequency printed circuit board (PCB) design, the contradiction between complex EDA compute workloads and time-to-market pressure, manufacturing variability and power management, to name but a few. In this dissertation, we will propose several new strategies to handle the challenges in the EDA field. Wire routing is an important step in the design of PCBs. Although there are many industrial tools to handle IC routing problems, very few tools can handle the ro...
Electronic Design Automation (EDA) tools are used to design computer chips, which may have billions ...
This paper introduces a multi-terminal escape routing algorithm for the design of Printed Circuit Bo...
Increasing challenges arise with each new semiconductor technology node, especially in advanced node...
As the semiconductor industry marches towards 22 nm technology and beyond, circuit design has become...
In electronic design automation (EDA), routing is one of the most important tasks for both printed c...
As IC technology advances rapidly, the dimensions of packages and PCBs are decreasing while the pin ...
As IC technology advances, the package size keeps shrinking while the pin count of a package keeps i...
As IC technology advances, the package size keeps shrinking while the pin count of a package keeps i...
As the semiconductor technology marches towards the 14nm node and beyond, EDA (electronic design au...
We have seen dramatic advances in the IC technology in the past several years. The shrinkage of die ...
The electronic design automation (EDA) tools are a specific set of software that play important role...
As die sizes are shrinking, and circuit complexities are increasing, the PCB routing problem becomes...
In VLSI physical design, the routing task consists of using over-the-cell metal wires to connect pin...
With the advancement in technology, the size of electronic components and printed circuit boards (PC...
This paper introduces a multiterminal escape routing algorithm for the design of printed circuit boa...
Electronic Design Automation (EDA) tools are used to design computer chips, which may have billions ...
This paper introduces a multi-terminal escape routing algorithm for the design of Printed Circuit Bo...
Increasing challenges arise with each new semiconductor technology node, especially in advanced node...
As the semiconductor industry marches towards 22 nm technology and beyond, circuit design has become...
In electronic design automation (EDA), routing is one of the most important tasks for both printed c...
As IC technology advances rapidly, the dimensions of packages and PCBs are decreasing while the pin ...
As IC technology advances, the package size keeps shrinking while the pin count of a package keeps i...
As IC technology advances, the package size keeps shrinking while the pin count of a package keeps i...
As the semiconductor technology marches towards the 14nm node and beyond, EDA (electronic design au...
We have seen dramatic advances in the IC technology in the past several years. The shrinkage of die ...
The electronic design automation (EDA) tools are a specific set of software that play important role...
As die sizes are shrinking, and circuit complexities are increasing, the PCB routing problem becomes...
In VLSI physical design, the routing task consists of using over-the-cell metal wires to connect pin...
With the advancement in technology, the size of electronic components and printed circuit boards (PC...
This paper introduces a multiterminal escape routing algorithm for the design of printed circuit boa...
Electronic Design Automation (EDA) tools are used to design computer chips, which may have billions ...
This paper introduces a multi-terminal escape routing algorithm for the design of Printed Circuit Bo...
Increasing challenges arise with each new semiconductor technology node, especially in advanced node...