The metal insulator semiconductor (MIS) structure is arguably the most technologically important type of solid in existence. The microelectronics revolution of the last thirty years is made possible largely due to the ability to realize extremely high quality metal/SiO$\sb2$/Si metal oxide semiconductor (MOS) structures. Unfortunately, silicon does not stand out in its ability to pass charge carriers with the highest speed. Significant improvements in the performance of many areas of electronics would result if another, high mobility semiconductor could be implemented into a high quality MIS structure.In this thesis, MIS structures incorporating two high-mobility semiconductors, GaAs and Ge, are investigated. An in situ, plasma-enhanced che...
Alternative semiconductor materials have the potential to replace silicon in next generation transis...
A thorough understanding and a well developed fabrication procedure of MIS structures are the prer...
International audienceThe challenges posed by the scaling of Silicon (Si) devices make mandatory the...
208 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1997.In this thesis, an in-depth s...
208 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1997.In this thesis, an in-depth s...
In this thesis, the growth, fabrication, and characterization of in-situ deposited III-V semiconduct...
In this thesis, the growth, fabrication, and characterization of in-situ deposited III-V semiconduct...
This thesis presents systematic studies on monolithic heteroepitaxial integration of III-V compound ...
A theoretical and experimental study of metal-insulator-semiconductor (MIS) structures on (Hg,Cd)Te ...
This chapter is from the book Properties of Gallium Arsenide (2nd Edition), which is comprised of 18...
A study has been conducted to investigate and compare the growth, strain, defects, electrical and op...
A study has been conducted to investigate and compare the growth, strain, defects, electrical and op...
Future CMOS technologies will require the use of very high mobility substrates together with high-κ ...
International audienceThe challenges posed by the scaling of Silicon (Si) devices make mandatory the...
International audienceThe challenges posed by the scaling of Silicon (Si) devices make mandatory the...
Alternative semiconductor materials have the potential to replace silicon in next generation transis...
A thorough understanding and a well developed fabrication procedure of MIS structures are the prer...
International audienceThe challenges posed by the scaling of Silicon (Si) devices make mandatory the...
208 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1997.In this thesis, an in-depth s...
208 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1997.In this thesis, an in-depth s...
In this thesis, the growth, fabrication, and characterization of in-situ deposited III-V semiconduct...
In this thesis, the growth, fabrication, and characterization of in-situ deposited III-V semiconduct...
This thesis presents systematic studies on monolithic heteroepitaxial integration of III-V compound ...
A theoretical and experimental study of metal-insulator-semiconductor (MIS) structures on (Hg,Cd)Te ...
This chapter is from the book Properties of Gallium Arsenide (2nd Edition), which is comprised of 18...
A study has been conducted to investigate and compare the growth, strain, defects, electrical and op...
A study has been conducted to investigate and compare the growth, strain, defects, electrical and op...
Future CMOS technologies will require the use of very high mobility substrates together with high-κ ...
International audienceThe challenges posed by the scaling of Silicon (Si) devices make mandatory the...
International audienceThe challenges posed by the scaling of Silicon (Si) devices make mandatory the...
Alternative semiconductor materials have the potential to replace silicon in next generation transis...
A thorough understanding and a well developed fabrication procedure of MIS structures are the prer...
International audienceThe challenges posed by the scaling of Silicon (Si) devices make mandatory the...