This paper analyzes the Channel Initiated Secondary Electron injection mechanism and the resulting hot-carrier degradation in deep sub-micron n-channel MOSFETs. The correlation between gate (I<SUB>G</SUB>) and substrate current (I<SUB>B</SUB>) has been studied for different values of substrate bias. Stress and charge pumping measurements have been carried out to study the degradation under identical substrate bias and gate current conditions. Results show that under identical gate current (programming time for flash memory cells), the degradation is less for higher negative substrate bias
In this work, a review of the reliability of n- and p-channel Si and SOI MOSFETs as a function of ga...
We studied the degradation of MOSFETs with 3.2 nm gate oxide under Fowler-Nordheim and channel hot c...
We studied the degradation of MOSFETs with 3.2 nm gate oxide under Fowler-Nordheim and channel hot c...
This paper analyzes the Channel Initiated Secondary Electron injection mechanism and the resulting h...
This paper analyzes the Channel Initiated Secondary Electron injection mechanism and the resulting h...
This paper analyzes in detail the substrate enhanced gate current injection mechanism and the result...
This paper analyzes in detail the substrate enhanced gate current injection mechanism and the result...
This paper analyzes in detail the substrate enhanced gate current injection mechanism and the result...
International audienceThe hot-carrier degradation induced by first- and second-impact ionization eve...
The linear drain current degradation of n-MOSFETs with different channel lengths and gate oxide thic...
With continued scaling of MOSFET\u27s, the reliability of thin gate oxides is becoming increasingly ...
International audienceThe effects of the substrate voltage are studied in advanced N-MOSFETs with a ...
Basic mechanisms governing the generation and injection of hot electrons in the N-channel MOSFET are...
This paper analyzes in detail the damage generation in n-channel MOS transistors operating in the su...
We studied the degradation of MOSFETs with 3.2 nm gate oxide under Fowler Nordheim and channel hot c...
In this work, a review of the reliability of n- and p-channel Si and SOI MOSFETs as a function of ga...
We studied the degradation of MOSFETs with 3.2 nm gate oxide under Fowler-Nordheim and channel hot c...
We studied the degradation of MOSFETs with 3.2 nm gate oxide under Fowler-Nordheim and channel hot c...
This paper analyzes the Channel Initiated Secondary Electron injection mechanism and the resulting h...
This paper analyzes the Channel Initiated Secondary Electron injection mechanism and the resulting h...
This paper analyzes in detail the substrate enhanced gate current injection mechanism and the result...
This paper analyzes in detail the substrate enhanced gate current injection mechanism and the result...
This paper analyzes in detail the substrate enhanced gate current injection mechanism and the result...
International audienceThe hot-carrier degradation induced by first- and second-impact ionization eve...
The linear drain current degradation of n-MOSFETs with different channel lengths and gate oxide thic...
With continued scaling of MOSFET\u27s, the reliability of thin gate oxides is becoming increasingly ...
International audienceThe effects of the substrate voltage are studied in advanced N-MOSFETs with a ...
Basic mechanisms governing the generation and injection of hot electrons in the N-channel MOSFET are...
This paper analyzes in detail the damage generation in n-channel MOS transistors operating in the su...
We studied the degradation of MOSFETs with 3.2 nm gate oxide under Fowler Nordheim and channel hot c...
In this work, a review of the reliability of n- and p-channel Si and SOI MOSFETs as a function of ga...
We studied the degradation of MOSFETs with 3.2 nm gate oxide under Fowler-Nordheim and channel hot c...
We studied the degradation of MOSFETs with 3.2 nm gate oxide under Fowler-Nordheim and channel hot c...