Add to ORKGThe temperature at surface of a silicon die depends on the activity of the circuits placed on it. In this paper, it is analyzed how Process, Voltage and Temperature (PVT) variations affect simultaneously some figures of merit (FoM) of some digital and analog circuits and the power dissipated by such circuits. It is shown that in some cases, a strong correlation exists between the variation of the circuit FoM and the variation of the dissipated power. Since local temperature increase at the silicon surface close to the circuit linearly depends on dissipated power, the results show that temperature can be considered as an observable magnitude for CMOS technology variability monitoring
One major problem for the designer of electronic systems is the presence of uncertainty, which is du...
This book discusses new techniques for detecting, controlling, and exploiting the impacts of tempera...
Higher die temperature due to increasing power density pose a major reliability concern in present-d...
The temperature at surface of a silicon die depends on the activity of the circuits placed on it. I...
Built-in test and on-chip calibration features are becoming essential for reliable wireless connecti...
Temperature fluctuations alter threshold voltage, carrier mobility, and saturation velocity of a MOS...
Integrated Circuit (IC) designers have always faced the problem of small deviations in parameters of...
Integrated Circuit (IC) designers have always faced the problem of small deviations in parameters of...
Built-in test and on-chip calibration features are becoming essential for reliable wireless connecti...
The growing packing density and power consumption of VLSI circuits have made thermal effects one of ...
The supply voltage to threshold voltage ratio is reduced with each new technology generation. The ga...
The heart of every switched mode converter consists of several switching semiconductor elements. Du...
As technology scales down in order to meet demands of more computing power per area, a variety of ch...
This paper introduces a novel on-chip measurement technique for the determination of the central fre...
One major problem for the designer of electronic systems is the presence of uncertainty, which is du...
One major problem for the designer of electronic systems is the presence of uncertainty, which is du...
This book discusses new techniques for detecting, controlling, and exploiting the impacts of tempera...
Higher die temperature due to increasing power density pose a major reliability concern in present-d...
The temperature at surface of a silicon die depends on the activity of the circuits placed on it. I...
Built-in test and on-chip calibration features are becoming essential for reliable wireless connecti...
Temperature fluctuations alter threshold voltage, carrier mobility, and saturation velocity of a MOS...
Integrated Circuit (IC) designers have always faced the problem of small deviations in parameters of...
Integrated Circuit (IC) designers have always faced the problem of small deviations in parameters of...
Built-in test and on-chip calibration features are becoming essential for reliable wireless connecti...
The growing packing density and power consumption of VLSI circuits have made thermal effects one of ...
The supply voltage to threshold voltage ratio is reduced with each new technology generation. The ga...
The heart of every switched mode converter consists of several switching semiconductor elements. Du...
As technology scales down in order to meet demands of more computing power per area, a variety of ch...
This paper introduces a novel on-chip measurement technique for the determination of the central fre...
One major problem for the designer of electronic systems is the presence of uncertainty, which is du...
One major problem for the designer of electronic systems is the presence of uncertainty, which is du...
This book discusses new techniques for detecting, controlling, and exploiting the impacts of tempera...
Higher die temperature due to increasing power density pose a major reliability concern in present-d...