In this letter, we present electrical and magnetic characteristics of HfO2-based metal-oxide-semiconductor capacitors (MOSCAPs), along with the effect of pseudomorphic Si as a passivating interlayer on GaAs(001) grown by molecular beam epitaxy. Ultrathin HfO2 high-k gate dielectric films (3–15 nm) have been grown on Si/GaAs(001) structures through evaporation of a Hf/HfO2 target in NO2 gas. The lowest interface states density Dit at Au/HfO2/Si/GaAs(001) MOS-structures were obtained in the range of (6−13)×101
[[abstract]]Molecular beam epitaxy (MBE) was employed to grow nanothick high kappa HfO2 films on Si ...
Low leakage current density and high relative permittivity (dielectric constant) are the key factors...
The deposition and characterization of HfO2 films for potential application as a high-k gate dielect...
In this letter, we present electrical and magnetic characteristics of HfO2-based metal-oxide-semicon...
Controlling monolayer Si oxide at the HfO2/Si interface is a challenging issue in scaling the equiva...
Numerous metal oxides have been studied worldwide as possible high-k gate dielectric candidates for ...
We report on HfO2 gate dielectrics grown by atomic layer deposition (ALD) at 600\ub0C on strained-Si...
This work deals with some fundamental material properties of the hafnia or hafnium oxide and the sil...
We have demonstrated that Fermi level pinning at the interface between InGaAs or GaAs and HfO2 gate ...
ABSTRACTGiven the demand for constantly scaling microelectronic devices to ever smaller dimensions, ...
Given the demand for constantly scaling microelectronic devices to ever smaller dimensions, a SiO2 g...
Given the demand for constantly scaling microelectronic devices to ever smaller dimensions, a SiO2 g...
textAs metal-oxide-semiconductor field-effect transistor (MOSFET) gate lengths scale down below 45 n...
The ultrathin SiO2 interfacial layer (IL) was adopted at the interface between atomic-layer-deposite...
textAs metal-oxide-semiconductor field-effect transistor (MOSFET) gate lengths scale down below 45 n...
[[abstract]]Molecular beam epitaxy (MBE) was employed to grow nanothick high kappa HfO2 films on Si ...
Low leakage current density and high relative permittivity (dielectric constant) are the key factors...
The deposition and characterization of HfO2 films for potential application as a high-k gate dielect...
In this letter, we present electrical and magnetic characteristics of HfO2-based metal-oxide-semicon...
Controlling monolayer Si oxide at the HfO2/Si interface is a challenging issue in scaling the equiva...
Numerous metal oxides have been studied worldwide as possible high-k gate dielectric candidates for ...
We report on HfO2 gate dielectrics grown by atomic layer deposition (ALD) at 600\ub0C on strained-Si...
This work deals with some fundamental material properties of the hafnia or hafnium oxide and the sil...
We have demonstrated that Fermi level pinning at the interface between InGaAs or GaAs and HfO2 gate ...
ABSTRACTGiven the demand for constantly scaling microelectronic devices to ever smaller dimensions, ...
Given the demand for constantly scaling microelectronic devices to ever smaller dimensions, a SiO2 g...
Given the demand for constantly scaling microelectronic devices to ever smaller dimensions, a SiO2 g...
textAs metal-oxide-semiconductor field-effect transistor (MOSFET) gate lengths scale down below 45 n...
The ultrathin SiO2 interfacial layer (IL) was adopted at the interface between atomic-layer-deposite...
textAs metal-oxide-semiconductor field-effect transistor (MOSFET) gate lengths scale down below 45 n...
[[abstract]]Molecular beam epitaxy (MBE) was employed to grow nanothick high kappa HfO2 films on Si ...
Low leakage current density and high relative permittivity (dielectric constant) are the key factors...
The deposition and characterization of HfO2 films for potential application as a high-k gate dielect...