Add to ORKG\u3cp\u3eAn CMP process will be presented which is optimised for low layout sensitivity and good uniformity. The best results were obtained by using a stack of two polishing cloths, instead of a single cloth. This results in a better planarisation capability while improving the uniformity compared to a single hard polishing cloth. The feasibility of the novel CMP process was demonstrated on a 64k SRAM.\u3c/p\u3
Recently, the rapid increase in the number of metallization layers in microelectronic devices couple...
textChemical-mechanical polishing (CMP) is an enabling technique used in deep- submicron VLSI manuf...
In a typical chemical-mechanical polishing (CMP) process for interlevel dielectric planarization, t...
Chemical Mechanical Polishing (CMP) is the only option for achieving local and global planarization ...
199 p.Chemical mechanical planarization (CMP) also known as chemical mechanical polishing has emerge...
Planarization techniques such as chemical-mechanical polishing (CMP) have emerged as enabling techno...
Chemical-Mechanical Polishing (CMP) has emerged as an enabling technology for manufacturing multi-le...
Chemical Mechanical Planarization (CMP) is a polishing process that planarizes a surface at both a l...
Chemical-Mechanical-Polishing (CMP), first used as a planarization technology in the manufacture of ...
Chemical Mechanical Polishing (CMP) is the technique known to provide global planarization of topogr...
Chemical-mechanical planarization, a technique which was developed by IBM researchers for the produc...
Chemical mechanical polishing (CMP) has been used for a long time in the manufacturing of prime sili...
CMP Chemical Mechanical Planarization Polishing for the purpose of planarizing integrated circuit st...
The present work reports on studies and process developments to utilize the chemical mechanical plan...
As the superparamagnetic limit is reached, the magnetic storage industry looks to circumvent the bar...
Recently, the rapid increase in the number of metallization layers in microelectronic devices couple...
textChemical-mechanical polishing (CMP) is an enabling technique used in deep- submicron VLSI manuf...
In a typical chemical-mechanical polishing (CMP) process for interlevel dielectric planarization, t...
Chemical Mechanical Polishing (CMP) is the only option for achieving local and global planarization ...
199 p.Chemical mechanical planarization (CMP) also known as chemical mechanical polishing has emerge...
Planarization techniques such as chemical-mechanical polishing (CMP) have emerged as enabling techno...
Chemical-Mechanical Polishing (CMP) has emerged as an enabling technology for manufacturing multi-le...
Chemical Mechanical Planarization (CMP) is a polishing process that planarizes a surface at both a l...
Chemical-Mechanical-Polishing (CMP), first used as a planarization technology in the manufacture of ...
Chemical Mechanical Polishing (CMP) is the technique known to provide global planarization of topogr...
Chemical-mechanical planarization, a technique which was developed by IBM researchers for the produc...
Chemical mechanical polishing (CMP) has been used for a long time in the manufacturing of prime sili...
CMP Chemical Mechanical Planarization Polishing for the purpose of planarizing integrated circuit st...
The present work reports on studies and process developments to utilize the chemical mechanical plan...
As the superparamagnetic limit is reached, the magnetic storage industry looks to circumvent the bar...
Recently, the rapid increase in the number of metallization layers in microelectronic devices couple...
textChemical-mechanical polishing (CMP) is an enabling technique used in deep- submicron VLSI manuf...
In a typical chemical-mechanical polishing (CMP) process for interlevel dielectric planarization, t...