The effective bandwidth of the FPGA external memory, usually DRAM, is extremely sensitive to the access pattern. Nonblocking caches that handle thousands of outstanding misses (miss-optimized memory systems) can dynamically improve bandwidth utilization whenever memory accesses are irregular and application-specific optimizations are not available or are too costly in terms of design time. However, they require a memory controller with wide data ports on the FPGA side and cannot fully take advantage of the memory interfaces with multiple narrow ports that are common on SoC FPGAs. Moreover, as their scope is limited to single memory requests, the access pattern they generate may cause frequent DRAM row conflicts, which further reduce DRAM ba...
In this paper, we present Bi-Modal Cache - a flexible stacked DRAM cache organization which simultan...
Process variations in integrated circuits have significant impact on their performance, leakage and ...
Die-stacking is a new technology that allows multiple integrated circuits to be stacked on top of ea...
For efficient acceleration on FPGA, it is essential for external memory to match the throughput of t...
Die-stacking technology allows conventional DRAM to be integrated with processors. While numerous op...
textContemporary DRAM systems have maintained impressive scaling by managing a careful balance betwe...
FPGAs rely on massive datapath parallelism to accelerate applications even with a low clock frequenc...
For decades, main memory has enjoyed the continuous scaling of its physical substrate: DRAM (Dynamic...
Many algorithms and applications in scientific computing exhibit irregular access patterns as consec...
Integrated circuits have been in constant progression since the first prototype in 1958, with the se...
Deep cache hierarchies and the latency-tolerating features of modern superscalar microprocessors hid...
Many data structures (e.g., matrices) are typically ac-cessed with multiple access patterns. Dependi...
The Impulse Adaptable Memory System exposes DRAM access patterns not seen in conventional memory sys...
Modern DRAM devices’ performance and energy efficiency are significantly improved when the ro...
The twin demands of energy-efficiency and higher performance on DRAM are highly emphasized in multic...
In this paper, we present Bi-Modal Cache - a flexible stacked DRAM cache organization which simultan...
Process variations in integrated circuits have significant impact on their performance, leakage and ...
Die-stacking is a new technology that allows multiple integrated circuits to be stacked on top of ea...
For efficient acceleration on FPGA, it is essential for external memory to match the throughput of t...
Die-stacking technology allows conventional DRAM to be integrated with processors. While numerous op...
textContemporary DRAM systems have maintained impressive scaling by managing a careful balance betwe...
FPGAs rely on massive datapath parallelism to accelerate applications even with a low clock frequenc...
For decades, main memory has enjoyed the continuous scaling of its physical substrate: DRAM (Dynamic...
Many algorithms and applications in scientific computing exhibit irregular access patterns as consec...
Integrated circuits have been in constant progression since the first prototype in 1958, with the se...
Deep cache hierarchies and the latency-tolerating features of modern superscalar microprocessors hid...
Many data structures (e.g., matrices) are typically ac-cessed with multiple access patterns. Dependi...
The Impulse Adaptable Memory System exposes DRAM access patterns not seen in conventional memory sys...
Modern DRAM devices’ performance and energy efficiency are significantly improved when the ro...
The twin demands of energy-efficiency and higher performance on DRAM are highly emphasized in multic...
In this paper, we present Bi-Modal Cache - a flexible stacked DRAM cache organization which simultan...
Process variations in integrated circuits have significant impact on their performance, leakage and ...
Die-stacking is a new technology that allows multiple integrated circuits to be stacked on top of ea...