An accurate estimation of the Blech length, the critical line length below which interconnect lines are immortal, is vital as it allows EDA tools to reduce their workload. In lines longer than the Blech length, either a void will inevitably nucleate and grow until the line fails, or the line will rupture. The majority of failure analyses reveal voiding as the failure mechanism however recent analysis suggest Blech length failures are characterised by simultaneous [6] voiding and rupture, and a non-zero steady-state drift velocity. This paper provides an alternative interpretation of results
Pure evaporated aluminum interconnects on a flat surface and over topography were subjected to high ...
Electromigration is the mass transport of atoms in a material due to elevated temperatures and an ap...
Electromigration driven void dynamics plays an important role in the reliability of copper interconn...
Electromigration failure in rigidly passivated metal interconnect lines is studied with particular r...
[[abstract]]Experiments were performed to study the effect of metal line width on electromigration c...
[[abstract]]Experiments were performed to study the effect of metal line width on electromigration c...
Thesis (Ph.D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2...
The electromigration EM lifetime in short copper interconnects is modeled using a previously devel...
Electromigration-induced stresses play a major role in the analysis and the explanation of this impo...
The stress evolution model (SEM) of Korhonenet al., is used to calculate the void nucleation time in...
Electromigration (EM) is a mass transport phenomenon resulting from the momentum transfer between th...
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, ...
Electromigration experiments have been carried out on straight interconnects that have single vias a...
For electromigration in short aluminum interconnects terminated by tungsten vias, the well known “sh...
The median-times-to-failure (t₅₀’s) for straight dual-damascene via-terminated copper ...
Pure evaporated aluminum interconnects on a flat surface and over topography were subjected to high ...
Electromigration is the mass transport of atoms in a material due to elevated temperatures and an ap...
Electromigration driven void dynamics plays an important role in the reliability of copper interconn...
Electromigration failure in rigidly passivated metal interconnect lines is studied with particular r...
[[abstract]]Experiments were performed to study the effect of metal line width on electromigration c...
[[abstract]]Experiments were performed to study the effect of metal line width on electromigration c...
Thesis (Ph.D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2...
The electromigration EM lifetime in short copper interconnects is modeled using a previously devel...
Electromigration-induced stresses play a major role in the analysis and the explanation of this impo...
The stress evolution model (SEM) of Korhonenet al., is used to calculate the void nucleation time in...
Electromigration (EM) is a mass transport phenomenon resulting from the momentum transfer between th...
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, ...
Electromigration experiments have been carried out on straight interconnects that have single vias a...
For electromigration in short aluminum interconnects terminated by tungsten vias, the well known “sh...
The median-times-to-failure (t₅₀’s) for straight dual-damascene via-terminated copper ...
Pure evaporated aluminum interconnects on a flat surface and over topography were subjected to high ...
Electromigration is the mass transport of atoms in a material due to elevated temperatures and an ap...
Electromigration driven void dynamics plays an important role in the reliability of copper interconn...