An experimental study has been conducted into the effects of package related failures in plastic encapsulated semiconductors. As a result of an extensive literature survey particular emphasis was placed on thermal and moisture related failure mechanisms. A number of accelerated life testing techniques including Highly Accelerated Stress Testing (HAST) were used to induced parameter drift and catastrophic failures. Examples of both insertion and surface mount package types were studied. Observations were made on the parameter drift and catastrophic failure mechanisms of plastic encapsulated Bipolar Junction Transistors in dual in line packages. Gain degradation was observed to be the most sensitive parameter of those measured. It is proposed...
Moisture induced failure in plastic encapsulated packages is one most important failure mechanisms i...
Polymers are widely used in microelectronics packaging as e.g. adhesives or encapsulants. Low cost a...
It is well-known that high thermal stresses induced interfacial delamination is a typical failure mo...
Goal was Assembly Test Chips (ATCs) which could be used for evaluating plastic encapsulation technol...
In many high reliability military and commercial avionics applications, the long-term reliability of...
For the package size, weight and cost advantages, plastic encapsulated techniques have been widely u...
The strength of the interfaces between dissimilar materials that make up an electronic component has...
The strength of the interfaces between dissimilar materials that make up an electronic component has...
The reliability and mechanical performance of electronic integrated circuit (IC) package is studied ...
ABSTRACT: In this study, we develop analytical stress models for the evaluation of thermally induced...
Moisture induced failure in plastic encapsulated packages is one most important failure mechanisms i...
Moisture induced failure in plastic encapsulated packages is one most important failure mechanisms i...
Moisture induced failure in plastic encapsulated packages is one most important failure mechanisms i...
Moisture induced failure in plastic encapsulated packages is one most important failure mechanisms i...
Moisture induced failure in plastic encapsulated packages is one most important failure mechanisms i...
Moisture induced failure in plastic encapsulated packages is one most important failure mechanisms i...
Polymers are widely used in microelectronics packaging as e.g. adhesives or encapsulants. Low cost a...
It is well-known that high thermal stresses induced interfacial delamination is a typical failure mo...
Goal was Assembly Test Chips (ATCs) which could be used for evaluating plastic encapsulation technol...
In many high reliability military and commercial avionics applications, the long-term reliability of...
For the package size, weight and cost advantages, plastic encapsulated techniques have been widely u...
The strength of the interfaces between dissimilar materials that make up an electronic component has...
The strength of the interfaces between dissimilar materials that make up an electronic component has...
The reliability and mechanical performance of electronic integrated circuit (IC) package is studied ...
ABSTRACT: In this study, we develop analytical stress models for the evaluation of thermally induced...
Moisture induced failure in plastic encapsulated packages is one most important failure mechanisms i...
Moisture induced failure in plastic encapsulated packages is one most important failure mechanisms i...
Moisture induced failure in plastic encapsulated packages is one most important failure mechanisms i...
Moisture induced failure in plastic encapsulated packages is one most important failure mechanisms i...
Moisture induced failure in plastic encapsulated packages is one most important failure mechanisms i...
Moisture induced failure in plastic encapsulated packages is one most important failure mechanisms i...
Polymers are widely used in microelectronics packaging as e.g. adhesives or encapsulants. Low cost a...
It is well-known that high thermal stresses induced interfacial delamination is a typical failure mo...