Add to ORKGProperties and application of polyimide-based composites by blending surface functionalized boron nitride nanoplate
In this study, we constructed hybrid three-dimensional (3D) filler networks by simply incorporating ...
High thermal conductivity, structural stability, good mechanical and anti-oxidant properties makes h...
It has been seen previously that addition of fillers to host material systems can create composites ...
Electronic devices are increasingly dense, underscoring the need for effective thermal management. A...
A strategy was reported to prepare boron nitride nanosheets (BNNSs) by a molten hydroxide assisted l...
This study suggests the simple and effective synthesis method of chemically interconnected hexagonal...
International audienceThe thermal conductivity of polyimide/boron nitride (PI/BN) nanocomposite thin...
Electrically insulating polymeric nanocomposites with high thermal conductivity have great potential...
The heat accumulation has become a serious problem due to electronic devices towards high power and ...
Modern electronics not only require the thermal management ability of polymer packaging materials bu...
AbstractThe purpose of this study is to improve thermal conductivity and properties of polypropylene...
We report here in the fabrication of enhanced thermal conductive pathway nanocomposites of boron nit...
As modern electronics are developed towards miniaturisation, high-degree integration and intelligent...
Polyimide (PI)/hexagonal boron nitride (h-BN) composites were produced via the thermal imidization p...
Due to the multi-tasking and miniaturization of electronic devices, faster heat transfer is required...
In this study, we constructed hybrid three-dimensional (3D) filler networks by simply incorporating ...
High thermal conductivity, structural stability, good mechanical and anti-oxidant properties makes h...
It has been seen previously that addition of fillers to host material systems can create composites ...
Electronic devices are increasingly dense, underscoring the need for effective thermal management. A...
A strategy was reported to prepare boron nitride nanosheets (BNNSs) by a molten hydroxide assisted l...
This study suggests the simple and effective synthesis method of chemically interconnected hexagonal...
International audienceThe thermal conductivity of polyimide/boron nitride (PI/BN) nanocomposite thin...
Electrically insulating polymeric nanocomposites with high thermal conductivity have great potential...
The heat accumulation has become a serious problem due to electronic devices towards high power and ...
Modern electronics not only require the thermal management ability of polymer packaging materials bu...
AbstractThe purpose of this study is to improve thermal conductivity and properties of polypropylene...
We report here in the fabrication of enhanced thermal conductive pathway nanocomposites of boron nit...
As modern electronics are developed towards miniaturisation, high-degree integration and intelligent...
Polyimide (PI)/hexagonal boron nitride (h-BN) composites were produced via the thermal imidization p...
Due to the multi-tasking and miniaturization of electronic devices, faster heat transfer is required...
In this study, we constructed hybrid three-dimensional (3D) filler networks by simply incorporating ...
High thermal conductivity, structural stability, good mechanical and anti-oxidant properties makes h...
It has been seen previously that addition of fillers to host material systems can create composites ...