© 2017 by the authors. Potential problems induced by the multilayered manufacturing process pose a serious threat to the long-term reliability of MEMSCAP® actuators under in-service thermal cycling. Damage would initiate and propagate in different material layers because of a large mismatch of their thermal expansions. In this research, residual stresses and variations of design parameters induced by metal multi-user micro electromechanical system processes (MetalMUMPs) were examined to evaluate their effects on the thermal fatigue lifetime of the multilayer structure and, thus, to improve MEMSCAP® design. Since testing in such micro internal structure is difficult to conduct and traditional testing schemes are destructive, a numerical subd...
AbstractThe process of buckling of thin compressed films deposited on polymethylmethacrylate (PMMA) ...
Microsystems and microelectronics are new technologies that are being increasingly integrated into e...
The increasing application of advanced electronic packages under harsh environmental conditions, ext...
Potential problems induced by the multilayered manufacturing process pose a serious threat to the lo...
The lifetime of micro electro-thermo-mechanical actuators with complex electro-thermo-mechanical cou...
Research on the processing, structure, properties and reliability of metal films and metallic microd...
The RF–MEMS switch undergoes a complex loading in service, including nonlinear electromechanical exc...
The study of interconnect reliability has a long history. The technology has advanced by miniaturiza...
Design for thermo-mechanical reliability of electronics components on the basis of parameterized Fin...
Damage, fatigue and failure of electronic packages for MEMS and related systems are often caused by ...
Many promising applications of MEMS based devices are in critical systems. Hence, their reliability ...
The mechanical fatigue behavior of gold microbeams is analyzed. Dedicated devices have beendesigned ...
The reliability of micro electro-mechanical systems (MEMS) became a fundamental topic of investigati...
Introduction: In recent years, solder joints have been continuously incorporated in electronics pack...
The thesis focuses on the study of the reliability of assemblies using Pb-free alloys under' harsh e...
AbstractThe process of buckling of thin compressed films deposited on polymethylmethacrylate (PMMA) ...
Microsystems and microelectronics are new technologies that are being increasingly integrated into e...
The increasing application of advanced electronic packages under harsh environmental conditions, ext...
Potential problems induced by the multilayered manufacturing process pose a serious threat to the lo...
The lifetime of micro electro-thermo-mechanical actuators with complex electro-thermo-mechanical cou...
Research on the processing, structure, properties and reliability of metal films and metallic microd...
The RF–MEMS switch undergoes a complex loading in service, including nonlinear electromechanical exc...
The study of interconnect reliability has a long history. The technology has advanced by miniaturiza...
Design for thermo-mechanical reliability of electronics components on the basis of parameterized Fin...
Damage, fatigue and failure of electronic packages for MEMS and related systems are often caused by ...
Many promising applications of MEMS based devices are in critical systems. Hence, their reliability ...
The mechanical fatigue behavior of gold microbeams is analyzed. Dedicated devices have beendesigned ...
The reliability of micro electro-mechanical systems (MEMS) became a fundamental topic of investigati...
Introduction: In recent years, solder joints have been continuously incorporated in electronics pack...
The thesis focuses on the study of the reliability of assemblies using Pb-free alloys under' harsh e...
AbstractThe process of buckling of thin compressed films deposited on polymethylmethacrylate (PMMA) ...
Microsystems and microelectronics are new technologies that are being increasingly integrated into e...
The increasing application of advanced electronic packages under harsh environmental conditions, ext...