The study of semiconductors has been of longstanding interest in science and engineering. Historically, researchers have wavered between silicon and germanium as the preferred semiconductor for practical applications. Today, modern devices are predominantly constructed of Si because it has several desirable properties including thermal stability and ease of coating with a dielectric layer. But as solid state devices continue to get smaller, SiO 2 layers fail to adequately insulate and do not prevent diffusion of dopants. Problems also exist with GeO2 because it is water-soluble and, therefore, a poor choice for device fabrication. A potential replacement coating is silicon nitride. Numerous investigations of SixN y are now being made and be...
Electron-induced processes on disilane $\rm Si\sb2H\sb6,$ trimethylsilane $\rm (CH\sb3)\sb3SiH$ (TMS...
Part 1The processing of semiconductor layer systems relies upon controlled plasma etching to achieve...
textMotivated by the need for a Ge surface passivation layer, chemical vapor deposition of thin (< 1...
As feature size in microelectronic devices decreases, silicon nitride and oxynitride are considered ...
Germanium is a promising channel material for the next generation MOSFET devices since it has superi...
266 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1982.Localized deposits of silicon...
266 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1982.Localized deposits of silicon...
Localized deposits of silicon nitride, which are stable to at least 5000 C, have been formed by a ne...
Localized deposits of silicon nitride, which are stable to at least 5000 C, have been formed by a ne...
The Si-Si, Ge-Ge, Si-Ge, Si-H, and Ge-H bonds are analyzed through $\rm Si\sb2H\sb6$ and $\rm Ge\sb2...
The reaction mechanisms of nitrogen containing compounds on semiconductor surfaces and the structure...
The reaction mechanisms of nitrogen containing compounds on semiconductor surfaces and the structure...
We present temperature-programmed desorption studies of the adsorption of submonolayer coverages of ...
The growth of Si and Ge on silicon nitride surfaces has been investigated using scanning tunneling m...
The interaction of various gases on evaporated germanium and silicon surfaces has been studied at ro...
Electron-induced processes on disilane $\rm Si\sb2H\sb6,$ trimethylsilane $\rm (CH\sb3)\sb3SiH$ (TMS...
Part 1The processing of semiconductor layer systems relies upon controlled plasma etching to achieve...
textMotivated by the need for a Ge surface passivation layer, chemical vapor deposition of thin (< 1...
As feature size in microelectronic devices decreases, silicon nitride and oxynitride are considered ...
Germanium is a promising channel material for the next generation MOSFET devices since it has superi...
266 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1982.Localized deposits of silicon...
266 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1982.Localized deposits of silicon...
Localized deposits of silicon nitride, which are stable to at least 5000 C, have been formed by a ne...
Localized deposits of silicon nitride, which are stable to at least 5000 C, have been formed by a ne...
The Si-Si, Ge-Ge, Si-Ge, Si-H, and Ge-H bonds are analyzed through $\rm Si\sb2H\sb6$ and $\rm Ge\sb2...
The reaction mechanisms of nitrogen containing compounds on semiconductor surfaces and the structure...
The reaction mechanisms of nitrogen containing compounds on semiconductor surfaces and the structure...
We present temperature-programmed desorption studies of the adsorption of submonolayer coverages of ...
The growth of Si and Ge on silicon nitride surfaces has been investigated using scanning tunneling m...
The interaction of various gases on evaporated germanium and silicon surfaces has been studied at ro...
Electron-induced processes on disilane $\rm Si\sb2H\sb6,$ trimethylsilane $\rm (CH\sb3)\sb3SiH$ (TMS...
Part 1The processing of semiconductor layer systems relies upon controlled plasma etching to achieve...
textMotivated by the need for a Ge surface passivation layer, chemical vapor deposition of thin (< 1...