This paper presents the experimental characterization of elastic–plastic behavior of the thin gold microstructures under an applied loading using electrostatic actuation. The test structures are designed and optimized to achieve high stress values in the double-clamped specimen with a rectangular cross-section. The stress–strain behavior and plastic strength of the microstructures is experimentally studied by measuring the static deflection of the central specimen, undergoing tensile stress, using electrostatic actuation. The tensile stress in the test specimen is estimated by the non-linear finite element method (FEM) simulations. The elastic–plastic behavior in the specimen is investigated by the repeated loading and measuring the variati...
The effect of mechanical fatigue on structural performances of gold devices is investigated. The pul...
This paper presents the experimental characterization of the creep effect in electrostatically actua...
This paper proposes a new strategy for detecting material strength loss under mechanical fatigue on ...
This paper presents a simple design of gold MEMS, with a central test specimen undergoing tensile lo...
This paper presents the design, FEM modeling and experimental characterization of the elastic-plast...
This paper investigates the effect of stress and strains concentration, due to the notch presence, o...
Abstract MEMS-based tensile testing devices are powerful tools for mechanical characterization of na...
This study is focused on the mechanical characterization of materials used in microelectronic and mi...
Mechanical properties of freestanding electroplated gold thin films were studied in relationship to ...
Mechanical properties of freestanding electroplated gold thin films were studied ...
Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838)Interna...
This paper investigates the influence of residual stress on the characteristics of electrostatic act...
A novel set of microstructures for on-wafer stress measurement is prensented, based on a lancet prin...
International audienceMechanical properties of freestanding electroplated gold thin films were studi...
This paper presents the simulation of specifically MEMS specimen in the presence of stress concentra...
The effect of mechanical fatigue on structural performances of gold devices is investigated. The pul...
This paper presents the experimental characterization of the creep effect in electrostatically actua...
This paper proposes a new strategy for detecting material strength loss under mechanical fatigue on ...
This paper presents a simple design of gold MEMS, with a central test specimen undergoing tensile lo...
This paper presents the design, FEM modeling and experimental characterization of the elastic-plast...
This paper investigates the effect of stress and strains concentration, due to the notch presence, o...
Abstract MEMS-based tensile testing devices are powerful tools for mechanical characterization of na...
This study is focused on the mechanical characterization of materials used in microelectronic and mi...
Mechanical properties of freestanding electroplated gold thin films were studied in relationship to ...
Mechanical properties of freestanding electroplated gold thin films were studied ...
Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838)Interna...
This paper investigates the influence of residual stress on the characteristics of electrostatic act...
A novel set of microstructures for on-wafer stress measurement is prensented, based on a lancet prin...
International audienceMechanical properties of freestanding electroplated gold thin films were studi...
This paper presents the simulation of specifically MEMS specimen in the presence of stress concentra...
The effect of mechanical fatigue on structural performances of gold devices is investigated. The pul...
This paper presents the experimental characterization of the creep effect in electrostatically actua...
This paper proposes a new strategy for detecting material strength loss under mechanical fatigue on ...