© 1993-2012 IEEE. Advanced scaling and the introduction of new materials in the metal-oxide-semiconductor field-effect transistor (MOSFET) raise concerns about its reliability. Several degradation mechanisms, depending on operating conditions and time, can cause a significant change of the transistor parameters. The transistor area plays a large role when it comes to aging. In large-area MOSFETs, aging appears deterministic, while in small-area devices it is stochastic and convoluted with random telegraph noise. This is analogous to the time-zero random variability, which also reduces as the transistor gate area increases. The scope of this paper is to extend the knowledge of the time-dependent random variability as a function of MOSFET gat...
Time-zero variability, bias temperature instability (BTI) and random telegraph noise (RTN) are issue...
Charge trapping at the channel interface is a fundamental issue that adversely affects the reliabili...
With the development of Very-Deep Sub-Micron technologies, process variability is becoming increasin...
The Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) is an integral part of the electronic...
Variability phenomena in CMOS technologies have become a growing concern in recent years. One of the...
Current and future semiconductor technology nodes, bring about a variety of challenges that pertain ...
The introduction of High-κ Metal Gate transistors led to higher integration density, low leakage cur...
As transistor dimensions are scaled down in accordance with Moore's Law to provide for improved perf...
Current and future semiconductor technology nodes, bring about a variety of challenges that pertain ...
Defects, both as-fabricated and generated during operation, are an inevitable reality of real-world ...
The novel probabilistic models of the random variations in nanoscale MOSFET's high frequency perform...
In this paper, the frequency dependence of the dynamic variation induced by AC NBTI aging in scaled ...
Statistical variability in ultra-scaled CMOS devices is a major challenge faced by the semiconductor...
This paper presents an extensive study of the interplay between as-fabricated (time-zero) variabilit...
The continuous demand for high performance applications and simultaneous lowering of power consumpti...
Time-zero variability, bias temperature instability (BTI) and random telegraph noise (RTN) are issue...
Charge trapping at the channel interface is a fundamental issue that adversely affects the reliabili...
With the development of Very-Deep Sub-Micron technologies, process variability is becoming increasin...
The Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) is an integral part of the electronic...
Variability phenomena in CMOS technologies have become a growing concern in recent years. One of the...
Current and future semiconductor technology nodes, bring about a variety of challenges that pertain ...
The introduction of High-κ Metal Gate transistors led to higher integration density, low leakage cur...
As transistor dimensions are scaled down in accordance with Moore's Law to provide for improved perf...
Current and future semiconductor technology nodes, bring about a variety of challenges that pertain ...
Defects, both as-fabricated and generated during operation, are an inevitable reality of real-world ...
The novel probabilistic models of the random variations in nanoscale MOSFET's high frequency perform...
In this paper, the frequency dependence of the dynamic variation induced by AC NBTI aging in scaled ...
Statistical variability in ultra-scaled CMOS devices is a major challenge faced by the semiconductor...
This paper presents an extensive study of the interplay between as-fabricated (time-zero) variabilit...
The continuous demand for high performance applications and simultaneous lowering of power consumpti...
Time-zero variability, bias temperature instability (BTI) and random telegraph noise (RTN) are issue...
Charge trapping at the channel interface is a fundamental issue that adversely affects the reliabili...
With the development of Very-Deep Sub-Micron technologies, process variability is becoming increasin...