In this paper, small- and large-signal performances of passive devices integrated on high-resistivity, trap-rich and gold-doped silicon wafers are presented and compared through measurements and simulations. The gold-doped silicon substrate was produced starting from standard silicon having a nominal resistivity of 56 cm. We show that the gold-doped substrate presents high effective resistivity and low losses suitable for RF applications. This has been demonstrated by measuring coplanar waveguides, crosstalk, inductors and band pass filter where we observed similar performances for small-signal measurements compared with trap-rich substrate. Large-signal measurements of gold-doped substrates show 60 dBm lower harmonic distortion than high-r...
The nonlinear behaviour of silicon substrates with different resistivities is analyzed using coplana...
Non-linear behaviour of RF coplanar transmission lines is analyzed for various values of Si substrat...
Nowadays and especially for high-speed digital and RF applications, silicon substrate is not anymore...
Inthispaper, small-andlarge-signal performancesofpassivedevices integratedonhigh-resistivity, trap-r...
Deep-level doping compensation process using elemental gold is used to create high resistivity silic...
In this study, high-resistivity gold-implanted silicon substrates developed for radio frequency (RF)...
Deep level doping compensation concept using elemental gold is utilised to create effectively high r...
This paper focuses on the comparison of various advanced substrates such as trap-rich (TR), porous s...
This paper focuses on the comparison of various advanced substrates such as trap-rich (TR), porous s...
The rapid development of wireless communication has led to the need for high-speed electronic device...
This paper focuses on the comparison of the RF performances of various advanced trap-rich (TR) silic...
The goal to achieve low microwave attenuation loss in a high-speed wireless communication system is...
The substrate effects on the performance of metal-insulator-metal (MIM) capacitors and spiral induct...
The nonlinear behaviour of silicon substrates with different resistivities is analyzed using coplana...
The nonlinear behaviour of silicon substrates with different resistivities is analyzed using coplana...
The nonlinear behaviour of silicon substrates with different resistivities is analyzed using coplana...
Non-linear behaviour of RF coplanar transmission lines is analyzed for various values of Si substrat...
Nowadays and especially for high-speed digital and RF applications, silicon substrate is not anymore...
Inthispaper, small-andlarge-signal performancesofpassivedevices integratedonhigh-resistivity, trap-r...
Deep-level doping compensation process using elemental gold is used to create high resistivity silic...
In this study, high-resistivity gold-implanted silicon substrates developed for radio frequency (RF)...
Deep level doping compensation concept using elemental gold is utilised to create effectively high r...
This paper focuses on the comparison of various advanced substrates such as trap-rich (TR), porous s...
This paper focuses on the comparison of various advanced substrates such as trap-rich (TR), porous s...
The rapid development of wireless communication has led to the need for high-speed electronic device...
This paper focuses on the comparison of the RF performances of various advanced trap-rich (TR) silic...
The goal to achieve low microwave attenuation loss in a high-speed wireless communication system is...
The substrate effects on the performance of metal-insulator-metal (MIM) capacitors and spiral induct...
The nonlinear behaviour of silicon substrates with different resistivities is analyzed using coplana...
The nonlinear behaviour of silicon substrates with different resistivities is analyzed using coplana...
The nonlinear behaviour of silicon substrates with different resistivities is analyzed using coplana...
Non-linear behaviour of RF coplanar transmission lines is analyzed for various values of Si substrat...
Nowadays and especially for high-speed digital and RF applications, silicon substrate is not anymore...