Add to ORKGJournal ArticleIn future microprocessors, communication will emerge as a major bottleneck. The authors advocate composing future interconnects of some wires that minimize latency, some that maximize bandwidth, and some that minimize power. A microarchitecture aware of these wire characteristics can steer on-chip data transfers tot he most appropriate wires, thus improving performance and saving energy
With exponentially increasing integration densities and shrinking characteristic geometries on a chi...
Abstract — Implementation of low energy, low latency transmission line interconnects on a network-on...
The semiconductor industry is erperiencing a paradigm shifl from “computation-bound design ” to “com...
Journal ArticleThe paper presents a preliminary evaluation of novel techniques that address a growi...
Concern about the performance of wires in scaled technologies has led to research exploring other co...
Graduation date: 2014For the past half century, CMOS process scaling has followed Moore's law, \ud a...
Journal ArticleImprovements in semiconductor technology have made it possible to include multiple p...
Several trends can be observed in modern microprocessor design. Architectures have become increasin...
Continuing VLSI technology scaling raises several deep submicron (DSM) problems like relatively slow...
As technology scales, interconnect planning has been widely regarded as one of the most critical fac...
Continuous technology scaling sharply reduces transistor delays, while fixed-length global wire dela...
Using on-chip interconnection networks in place of ad-hoc global wiring structures the top level wir...
Due to continually shrinking feature sizes, higher clock frequencies, and the simultaneous growth in...
The roots of this book, and of the new research field that it defines, lie in the scaling of VLSI te...
As processor cores become ever smaller and more power efficient, coupled with the growth of multicor...
With exponentially increasing integration densities and shrinking characteristic geometries on a chi...
Abstract — Implementation of low energy, low latency transmission line interconnects on a network-on...
The semiconductor industry is erperiencing a paradigm shifl from “computation-bound design ” to “com...
Journal ArticleThe paper presents a preliminary evaluation of novel techniques that address a growi...
Concern about the performance of wires in scaled technologies has led to research exploring other co...
Graduation date: 2014For the past half century, CMOS process scaling has followed Moore's law, \ud a...
Journal ArticleImprovements in semiconductor technology have made it possible to include multiple p...
Several trends can be observed in modern microprocessor design. Architectures have become increasin...
Continuing VLSI technology scaling raises several deep submicron (DSM) problems like relatively slow...
As technology scales, interconnect planning has been widely regarded as one of the most critical fac...
Continuous technology scaling sharply reduces transistor delays, while fixed-length global wire dela...
Using on-chip interconnection networks in place of ad-hoc global wiring structures the top level wir...
Due to continually shrinking feature sizes, higher clock frequencies, and the simultaneous growth in...
The roots of this book, and of the new research field that it defines, lie in the scaling of VLSI te...
As processor cores become ever smaller and more power efficient, coupled with the growth of multicor...
With exponentially increasing integration densities and shrinking characteristic geometries on a chi...
Abstract — Implementation of low energy, low latency transmission line interconnects on a network-on...
The semiconductor industry is erperiencing a paradigm shifl from “computation-bound design ” to “com...