Journal ArticleImprovements in semiconductor technology have made it possible to include multiple processor cores on a single die. Chip Multi-Processors (CMP) are an attractive choice for future billion transistor architectures due to their low design complexity, high clock frequency, and high throughput. In a typical CMP architecture, the L2 cache is shared by multiple cores and data coherence is maintained among private L1s. Coherence operations entail frequent communication over global on-chip wires. In future technologies, communication between different L1s will have a significant impact on overall processor performance and power consumption. On-chip wires can be designed to have different latency, bandwidth, and energy proper...