Journal ArticleA wafer scale bulge testing system has been constructed to study the mechanical properties of thin films and microstructures. The custom built test stage was coupled with a pressure regulation system and optical profilometer which gives high accuracy three-dimensional topographic images collected on the time scale of seconds. Membrane deflection measurements can be made on the wafer scale (50-150 mm) with up to nanometer-scale vertical resolution. Gauge pressures up to 689 kPa (100 psi) are controlled using an electronic regulator with and accuracy of approximately 0.344 kPa (0.05 psi). Initial testing was performed on square diaphragms 350, 550, and 1200 µm in width comprised of 720± 10 nm thick low pressure chemical vapor d...
Ultra-thin membranes find an increasing amount of applications within the high-tech sector to obtain...
A novel microbridge testing method for thin films is proposed. Theoretic analysis and finite element...
A new technique for measurement of tensile stress in thin films is described. Motivated by the need ...
The aim of this work is to compare several methods for the determination of very thin films Young's...
International audienceThe aim of this work is to compare several methods for the determination of ve...
The bulge test apparatus designed for the measurement of mechanical material properties of thin film...
International audienceKnowledge of thin films mechanical properties is strongly associated to the re...
Un nouvel essai mécanique a été développé pour répondre à la demande d'analyse des propriétés mécani...
A new mechanical testing device of free standing membranes by Bulge Test has been built at Institute...
The Bulge test proved to be a useful tool for measuring elastic properties of thin films and\nfree s...
This study shows a methodology to estimate mechanical parameters of thin films by means of a bulge t...
The bulge test is successfully extended to the determination of the fracture properties of silicon n...
A new bulge testing setup for the measurement of the mechanical properties of thin films is presente...
The aim of this thesis is to develop and optimize a bench test for mechanical characterization of th...
This study investigated the techniques for determining the elastic modulus and estimating the stress...
Ultra-thin membranes find an increasing amount of applications within the high-tech sector to obtain...
A novel microbridge testing method for thin films is proposed. Theoretic analysis and finite element...
A new technique for measurement of tensile stress in thin films is described. Motivated by the need ...
The aim of this work is to compare several methods for the determination of very thin films Young's...
International audienceThe aim of this work is to compare several methods for the determination of ve...
The bulge test apparatus designed for the measurement of mechanical material properties of thin film...
International audienceKnowledge of thin films mechanical properties is strongly associated to the re...
Un nouvel essai mécanique a été développé pour répondre à la demande d'analyse des propriétés mécani...
A new mechanical testing device of free standing membranes by Bulge Test has been built at Institute...
The Bulge test proved to be a useful tool for measuring elastic properties of thin films and\nfree s...
This study shows a methodology to estimate mechanical parameters of thin films by means of a bulge t...
The bulge test is successfully extended to the determination of the fracture properties of silicon n...
A new bulge testing setup for the measurement of the mechanical properties of thin films is presente...
The aim of this thesis is to develop and optimize a bench test for mechanical characterization of th...
This study investigated the techniques for determining the elastic modulus and estimating the stress...
Ultra-thin membranes find an increasing amount of applications within the high-tech sector to obtain...
A novel microbridge testing method for thin films is proposed. Theoretic analysis and finite element...
A new technique for measurement of tensile stress in thin films is described. Motivated by the need ...