Add to ORKGhttps://ieee-iedm.org/program/eds-function/The heterogeneous integration roadmap (HIR) offers professionals, industry, academia and research institutes a comprehensive, strategic forecast of technology over the next 15 years. The HIR also delivers a 25-year projection for heterogeneous integration of emerging devices and materials with longer research-and-development timelines. In this talk, the aspects of co-design current state of the art, challenges and prospects are discussed. The need of cross-domain design tools for chip-package-pcb are highlighted. Also, the new design requirements for novel computing paradigms such as neuromorphic and quantum computing are discussed
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integrati...
This paper discusses several forms of heterogeneity in systems on chip and systems in package. A mea...
Since pioneering studies in the area of Human-Computer Interactions (HCI), there have been leaps in ...
Abstract—The economic and social demand for ubiquitous and multifaceted electronic systems—in combin...
As heterogeneous integration and orthogonal scaling gradually dominate the semiconductor industry ec...
Modern HPC systems are becoming increasingly heterogeneous, affecting all components of HPC systems,...
The use of micro--level integration technologies to manufacture high-end systems (such as in microel...
With the advances of on chip/package integration technologies, a new generation of autonomous ultra ...
The continued push for microelectronics scaling has driven many changes in modern transistor design,...
Abstract—Single-chip heterogeneous multiprocessors (SCHMs) are arising to meet the computational dem...
Decreasing the bill of materials for an electronic device saves development time, money and space. T...
These technologies stack and interconnect materials and components to achieve high density, small si...
The inherent potentials of the Si technology are limited by the low interaction with packaging. Co-d...
ABSTRACT — Microsystems technology is increasingly comprised of multi-function devices and material...
The computing world is witnessing a proverbial Cambrian explosion of emerging paradigms propelled by...
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integrati...
This paper discusses several forms of heterogeneity in systems on chip and systems in package. A mea...
Since pioneering studies in the area of Human-Computer Interactions (HCI), there have been leaps in ...
Abstract—The economic and social demand for ubiquitous and multifaceted electronic systems—in combin...
As heterogeneous integration and orthogonal scaling gradually dominate the semiconductor industry ec...
Modern HPC systems are becoming increasingly heterogeneous, affecting all components of HPC systems,...
The use of micro--level integration technologies to manufacture high-end systems (such as in microel...
With the advances of on chip/package integration technologies, a new generation of autonomous ultra ...
The continued push for microelectronics scaling has driven many changes in modern transistor design,...
Abstract—Single-chip heterogeneous multiprocessors (SCHMs) are arising to meet the computational dem...
Decreasing the bill of materials for an electronic device saves development time, money and space. T...
These technologies stack and interconnect materials and components to achieve high density, small si...
The inherent potentials of the Si technology are limited by the low interaction with packaging. Co-d...
ABSTRACT — Microsystems technology is increasingly comprised of multi-function devices and material...
The computing world is witnessing a proverbial Cambrian explosion of emerging paradigms propelled by...
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integrati...
This paper discusses several forms of heterogeneity in systems on chip and systems in package. A mea...
Since pioneering studies in the area of Human-Computer Interactions (HCI), there have been leaps in ...