Add to ORKGNecessity of resistive layer growth under the contact and in the contact zone of resistive element is shown in order to reduce peak values of current flow and power dissipation in the contact of thin film resistor, thereby to increase the resistor stability to parametric and catastrophic failures
Superconducting Fault Current Limiters (SFCLs) are able to reduce fault currents to an acceptable va...
[[abstract]]The resistance, resistance versus temperature, thermal stability, electrical stress, and...
When a printed and dried thick film resistor is subjected to firing, it undergoes many structural ch...
The analytical model of the calculation of the contact resistance of the thin-film resistor is Offer...
Ein Zuverlässigkeitsmodell für Dickschichtwiderstände wird vorgestellt, welches die Widerstandsänder...
Electronic devices with high performance are becoming smaller and lighter. The passive components re...
Stationary electrical connections and contacts, such as power connections, are commonly applied in e...
The degradation of SiCr-based thin-film resistors under current and temperature stress and the Joule...
Degradation of thin film interconnects and ultra-thin dielectrics is studied within a stochastic app...
Many applications in organic and printed electronic circuits require the implementation of resistors...
This paper is focused on the thick-film power resistors with copper terminals. These terminals are c...
The electronics industry has observed an increase in the incidents of corrosion failures in data cen...
There have been a number of advancements in discrete resistor technologies over recent years and, al...
In an integrated circuit the substrate on which various passive devices are printed and fired, a res...
Reliability experiments on hybrid circuits are usually carried out by accelerated ageing test. The c...
Superconducting Fault Current Limiters (SFCLs) are able to reduce fault currents to an acceptable va...
[[abstract]]The resistance, resistance versus temperature, thermal stability, electrical stress, and...
When a printed and dried thick film resistor is subjected to firing, it undergoes many structural ch...
The analytical model of the calculation of the contact resistance of the thin-film resistor is Offer...
Ein Zuverlässigkeitsmodell für Dickschichtwiderstände wird vorgestellt, welches die Widerstandsänder...
Electronic devices with high performance are becoming smaller and lighter. The passive components re...
Stationary electrical connections and contacts, such as power connections, are commonly applied in e...
The degradation of SiCr-based thin-film resistors under current and temperature stress and the Joule...
Degradation of thin film interconnects and ultra-thin dielectrics is studied within a stochastic app...
Many applications in organic and printed electronic circuits require the implementation of resistors...
This paper is focused on the thick-film power resistors with copper terminals. These terminals are c...
The electronics industry has observed an increase in the incidents of corrosion failures in data cen...
There have been a number of advancements in discrete resistor technologies over recent years and, al...
In an integrated circuit the substrate on which various passive devices are printed and fired, a res...
Reliability experiments on hybrid circuits are usually carried out by accelerated ageing test. The c...
Superconducting Fault Current Limiters (SFCLs) are able to reduce fault currents to an acceptable va...
[[abstract]]The resistance, resistance versus temperature, thermal stability, electrical stress, and...
When a printed and dried thick film resistor is subjected to firing, it undergoes many structural ch...