Abstract Micro-Raman (μRS) and micro-photoluminescence spectroscopy (μPLS) are demonstrated as valuable characterization techniques for fundamental research on silicon as well as for technological issues in the photovoltaic production. We measure the quantitative carrier recombination lifetime and the doping density with submicron resolution by μPLS and μRS. μPLS utilizes the carrier diffusion from a point excitation source and μRS the hole density-dependent Fano resonances of the first order Raman peak. This is demonstrated on micro defects in multicrystalline silicon. In comparison with the stress measurement by μRS, these measurements reveal the influence of stress on the recombination activity of metal...
We push the resolution limits of synchrotron-based nano-X-ray fluorescence mapping below 100 nm to i...
The electrical breakdown of silicon solar cells at low reverse currents has recently gained increase...
In the present work we studied the depth of damage layer in machined silicon wafers that was incorpo...
Micro-Raman (RS) and micro-photoluminescence spectroscopy (PLS) are demonstrated as valuable charact...
Defect rich regions in multicrystalline silicon are by Raman spectroscopy at high and low injection ...
We introduce a comprehensive characterization approach of microscopic technological structures in ad...
AbstractWe introduce a comprehensive characterization approach of microscopic technological structur...
Micro-Raman spectroscopy has been used to investigate the acceptor distribution in highly p-doped si...
Significant improvements in the experimental setup of Micro-Raman (mu RS) and Micro-Photoluminescenc...
AbstractSignificant improvements in the experimental setup of Micro-Raman (μRS) and Micro-Photolumin...
Microscopic laser-doped regions in advanced solar cell concepts are analyzed to determine the doping...
This paper demonstrates the usefulness of optical microcharacterization for process control and defe...
Simultaneous and locally resolved determination of the mechanical stress variation and the free hole...
We report research on the characterization of stresses in relation to defects in multicrystalline si...
Stress measurements by Raman spectroscopy have been performed on microelectronic devices. Strain-ind...
We push the resolution limits of synchrotron-based nano-X-ray fluorescence mapping below 100 nm to i...
The electrical breakdown of silicon solar cells at low reverse currents has recently gained increase...
In the present work we studied the depth of damage layer in machined silicon wafers that was incorpo...
Micro-Raman (RS) and micro-photoluminescence spectroscopy (PLS) are demonstrated as valuable charact...
Defect rich regions in multicrystalline silicon are by Raman spectroscopy at high and low injection ...
We introduce a comprehensive characterization approach of microscopic technological structures in ad...
AbstractWe introduce a comprehensive characterization approach of microscopic technological structur...
Micro-Raman spectroscopy has been used to investigate the acceptor distribution in highly p-doped si...
Significant improvements in the experimental setup of Micro-Raman (mu RS) and Micro-Photoluminescenc...
AbstractSignificant improvements in the experimental setup of Micro-Raman (μRS) and Micro-Photolumin...
Microscopic laser-doped regions in advanced solar cell concepts are analyzed to determine the doping...
This paper demonstrates the usefulness of optical microcharacterization for process control and defe...
Simultaneous and locally resolved determination of the mechanical stress variation and the free hole...
We report research on the characterization of stresses in relation to defects in multicrystalline si...
Stress measurements by Raman spectroscopy have been performed on microelectronic devices. Strain-ind...
We push the resolution limits of synchrotron-based nano-X-ray fluorescence mapping below 100 nm to i...
The electrical breakdown of silicon solar cells at low reverse currents has recently gained increase...
In the present work we studied the depth of damage layer in machined silicon wafers that was incorpo...