International audienceThis study deals with the electrical characterization of PiN diodes fabricated on a 4°off-axis 4H-SiC n+ substrate with a n- epilayer (1×1016 cm-3 / 10 µm). Optimized p++ epitaxial areas were grown by Vapour-Liquid-Solid (VLS) transport to form p+ emitters localized in etched wells with 1 µm depth. Incorporated Al level in the VLS p++ zones was checked by SIMS (Secondary Ion Mass Spectroscopy), and the doping level was found in the range of 1-3×1020 at.cm-3. Electrical characterizations were performed on these PiN diodes, with 800 nm deposit of aluminium as ohmic contact on p-type SiC. Electrical measurements show a bipolar behaviour, and very high sustainable forward current densities ≥ 3 kA.cm-2, preserving a low lea...
Forward bias degradation caused by basal plane dislocations (BPDs) in the substrate is the critical ...
Abstract The distribution of energy levels within the bandgap of epitaxial 4H-SiC p + /n junctions...
In this paper the results of a study in which the surface quality of 30, 35 and 110 µm 4H-SiC epitax...
International audienceThis study deals with the electrical characterization of PiN diodes fabricated...
The objective of the VELSIC project has been to demonstrate the feasibility of 1 µm deep p+/n- junct...
International audienceSiC Selective Epitaxial Growth (SEG) by Vapor-Liquid-Solid (VLS) transport on ...
International audienceUnipolar SiC devices like Schottky diodes, MESFET and JFET are already or will...
International audienceP-type 4H-SiC layers formed by ion implantation need high temperature processe...
International audienceP/N junctions have been fabricated with N+ commercial 4H-SiC substrate on whic...
L'objectif du projet VELSIC a été de démontrer la faisabilité de jonctions p+/n- profondes dans le s...
International audienceLateral JFET transistors have been fabricated with N and P-type channels tenta...
Homoepitaxial growth of 4H-SiC on off-oriented Si-face(0001) substrates was performed by using the s...
Forward bias degradation caused by basal plane dislocations (BPDs) in the substrate is the critical ...
Abstract The distribution of energy levels within the bandgap of epitaxial 4H-SiC p + /n junctions...
In this paper the results of a study in which the surface quality of 30, 35 and 110 µm 4H-SiC epitax...
International audienceThis study deals with the electrical characterization of PiN diodes fabricated...
The objective of the VELSIC project has been to demonstrate the feasibility of 1 µm deep p+/n- junct...
International audienceSiC Selective Epitaxial Growth (SEG) by Vapor-Liquid-Solid (VLS) transport on ...
International audienceUnipolar SiC devices like Schottky diodes, MESFET and JFET are already or will...
International audienceP-type 4H-SiC layers formed by ion implantation need high temperature processe...
International audienceP/N junctions have been fabricated with N+ commercial 4H-SiC substrate on whic...
L'objectif du projet VELSIC a été de démontrer la faisabilité de jonctions p+/n- profondes dans le s...
International audienceLateral JFET transistors have been fabricated with N and P-type channels tenta...
Homoepitaxial growth of 4H-SiC on off-oriented Si-face(0001) substrates was performed by using the s...
Forward bias degradation caused by basal plane dislocations (BPDs) in the substrate is the critical ...
Abstract The distribution of energy levels within the bandgap of epitaxial 4H-SiC p + /n junctions...
In this paper the results of a study in which the surface quality of 30, 35 and 110 µm 4H-SiC epitax...