In the nanoscale technology, both the device and interconnect performances affect the overall performance of the integrated circuits and systems in which they are used. So, it is quite natural to explore various solutions for devices as well as interconnects to mitigate the challenges of technology scaling and meet high-speed demand. This chapter discusses the use of carbon nanotubes (CNTs) as a potential high-speed high-performance interconnect as compared to the metal interconnects
The current paradigm of using Cu interconnects for on-chip global communication is rapidly becoming ...
The copper interconnects cannot keep pace with the IC interconnect requirements as the feature size ...
As the interconnect delay exceeds the gate delay, the integrated circuit (IC) technology has evolved...
In the nanoscale technology, both the device and interconnect performances affect the overall perfor...
© 2014 IEEE. As prevailing copper interconnect technology advances to its fundamental physical limit...
© 2016 World Scientific Publishing Company. While copper interconnect scaling is approaching its fun...
In this paper present the performance analysis of two possible realizations of a CNT-based nano-inte...
Abstract—Metallic carbon nanotubes (CNTs) have received much attention for their unique characterist...
Abstract—This paper presents a comprehensive study of the ap-plicability of single-walled carbon nan...
International audienceCarbon nanotubes (CNTs) due to their unique mechanical, thermal and electrical...
The work in this paper analyses the applicability of carbon nanotube (CNT) bundles as interconnects ...
The brief primarily focuses on the performance analysis of CNT based interconnects in current resear...
Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering,...
Carbon nanotubes (CNTs) have emerged as a potential nanoelectronic material that can replace traditi...
Increasing resistivity of copper with scaling and rising demands on current density requirements are...
The current paradigm of using Cu interconnects for on-chip global communication is rapidly becoming ...
The copper interconnects cannot keep pace with the IC interconnect requirements as the feature size ...
As the interconnect delay exceeds the gate delay, the integrated circuit (IC) technology has evolved...
In the nanoscale technology, both the device and interconnect performances affect the overall perfor...
© 2014 IEEE. As prevailing copper interconnect technology advances to its fundamental physical limit...
© 2016 World Scientific Publishing Company. While copper interconnect scaling is approaching its fun...
In this paper present the performance analysis of two possible realizations of a CNT-based nano-inte...
Abstract—Metallic carbon nanotubes (CNTs) have received much attention for their unique characterist...
Abstract—This paper presents a comprehensive study of the ap-plicability of single-walled carbon nan...
International audienceCarbon nanotubes (CNTs) due to their unique mechanical, thermal and electrical...
The work in this paper analyses the applicability of carbon nanotube (CNT) bundles as interconnects ...
The brief primarily focuses on the performance analysis of CNT based interconnects in current resear...
Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering,...
Carbon nanotubes (CNTs) have emerged as a potential nanoelectronic material that can replace traditi...
Increasing resistivity of copper with scaling and rising demands on current density requirements are...
The current paradigm of using Cu interconnects for on-chip global communication is rapidly becoming ...
The copper interconnects cannot keep pace with the IC interconnect requirements as the feature size ...
As the interconnect delay exceeds the gate delay, the integrated circuit (IC) technology has evolved...