High temperature die attach material has excellent corrosion resistance, good ductility, good electrical volume resistivity. Therefore, die attach materials have been introduced for electronic packaging. Nanoparticles have high surface energies and was developed for the use at high operational temperature. There are a lot of type of materials have been developed to prepare nanopaste which is very costly. Besides, electrical characteristic also been another issue. Through this study, Cu and Al nanoparticles were introduced in order to synthesize nanopaste by varying the aluminium percentage at 20%, 40%, 60% and 80%. CuO compound was found in the nanopaste indicated the presence of oxidation process. The use of organic additives was controlle...
To support the harsh environment of power electronics, such as high operating temperature, and high ...
There are two main technologies for the commercialization of printable and flexible electronic devic...
Abstract: Al-Cu-Al2O3 / Gr Nano compound was successfully prepared by metallic powder method, 6 samp...
Die attach material plays an important role in electronic packaging as it serves as an interconnecti...
This paper aims to report an aluminum-copper (Al-Cu) die-attach system as a Pb-free alternative for ...
A silver-copper (Ag-Cu) nanopaste formulated by mixing Ag and Cu nanoparticles with organic additive...
Copper nanoparticles (Cu NPs) that are passivated with thin layers of amine-based organic materials ...
In this work, thermal characteristic of silver-copper (Ag-Cu) nanopaste that consists of a mixture o...
Power electronics demand miniaturization, integration, higher electrical and ther-mal conductivities...
Satu nano-pes argentum-kuprum (Ag-Cu) yang dirumuskan dengan mencampurkan nanopartikel Ag dan Cu de...
Electronic devices used for extreme high temperature (>500oC) for instance in aviation and aerospac...
An Ag-Al nanopaste for high temperature die attach applications on SiC power devices has been develo...
Harsh environment electronics need to maintain their functionality while working at conditions such ...
There is a high demand for the implementation of metallic nanoparticle (NP) sintering technology for...
One of the fundamental requirements for high-temperature electronic packaging is reliable silicon at...
To support the harsh environment of power electronics, such as high operating temperature, and high ...
There are two main technologies for the commercialization of printable and flexible electronic devic...
Abstract: Al-Cu-Al2O3 / Gr Nano compound was successfully prepared by metallic powder method, 6 samp...
Die attach material plays an important role in electronic packaging as it serves as an interconnecti...
This paper aims to report an aluminum-copper (Al-Cu) die-attach system as a Pb-free alternative for ...
A silver-copper (Ag-Cu) nanopaste formulated by mixing Ag and Cu nanoparticles with organic additive...
Copper nanoparticles (Cu NPs) that are passivated with thin layers of amine-based organic materials ...
In this work, thermal characteristic of silver-copper (Ag-Cu) nanopaste that consists of a mixture o...
Power electronics demand miniaturization, integration, higher electrical and ther-mal conductivities...
Satu nano-pes argentum-kuprum (Ag-Cu) yang dirumuskan dengan mencampurkan nanopartikel Ag dan Cu de...
Electronic devices used for extreme high temperature (>500oC) for instance in aviation and aerospac...
An Ag-Al nanopaste for high temperature die attach applications on SiC power devices has been develo...
Harsh environment electronics need to maintain their functionality while working at conditions such ...
There is a high demand for the implementation of metallic nanoparticle (NP) sintering technology for...
One of the fundamental requirements for high-temperature electronic packaging is reliable silicon at...
To support the harsh environment of power electronics, such as high operating temperature, and high ...
There are two main technologies for the commercialization of printable and flexible electronic devic...
Abstract: Al-Cu-Al2O3 / Gr Nano compound was successfully prepared by metallic powder method, 6 samp...