With growing chip sizes and operating frequencies, on-chip global interconnect has become a critical bottleneck for CMOS technology. With processes scaling into deep submicron scales, the gap between gate delay and global-interconnect delay increases with each technology generation. Bandwidth is also important for on-chip interconnect and is limited by skew and jitter. Due to temperature variation, crosstalk noise, power supply variation and parameter variation, timing variation increases with the length of global interconnect lines. Jitter and skew in the transmitter and receiver's clocks add timing variation to on-chip interconnect communication. Repeaters in a buffering technique amplify clock jitter and drop pulses due to intersymbol...
Low-swing on-chip interconnect circuits have been viewed as alternative solutions to the problem of ...
With the rapid increase in transmission speeds of communication systems, the demand for very high-sp...
Abstrnct-The propagation delay of interconnection lines is a major factor in determining the perform...
With growing chip sizes and operating frequencies, on-chip global interconnect has become a critical...
High performance digital systems make extensive use of pipelines. Three years ago, "surfing" pipeli...
Abstract—Every new VLSI technology generation has resulted in interconnects increasingly limiting th...
Chip size shrinks as a result of VLSI's aggressive technology scaling. In a number of ways, this ong...
The aggressive technology scaling in VLSI leads to decrease the size of chip. Such continual miniatu...
As technology scales, interconnect planning has been widely regarded as one of the most critical fac...
With exponentially increasing integration densities and shrinking characteristic geometries on a chi...
Continuing VLSI technology scaling raises several deep submicron (DSM) problems like relatively slow...
Due to architectural complexity and process costs, circuit-level solutions are often the preferred m...
As semiconductor technology advances in the ultra deep sub -micron era, on-chip global interconnecti...
In the literature, surfing technique has been proposed for single ended wave-pipelined serial interc...
Abstract—This paper describes a novel global on-chip interconnect scheme, in which a one UI-delayed ...
Low-swing on-chip interconnect circuits have been viewed as alternative solutions to the problem of ...
With the rapid increase in transmission speeds of communication systems, the demand for very high-sp...
Abstrnct-The propagation delay of interconnection lines is a major factor in determining the perform...
With growing chip sizes and operating frequencies, on-chip global interconnect has become a critical...
High performance digital systems make extensive use of pipelines. Three years ago, "surfing" pipeli...
Abstract—Every new VLSI technology generation has resulted in interconnects increasingly limiting th...
Chip size shrinks as a result of VLSI's aggressive technology scaling. In a number of ways, this ong...
The aggressive technology scaling in VLSI leads to decrease the size of chip. Such continual miniatu...
As technology scales, interconnect planning has been widely regarded as one of the most critical fac...
With exponentially increasing integration densities and shrinking characteristic geometries on a chi...
Continuing VLSI technology scaling raises several deep submicron (DSM) problems like relatively slow...
Due to architectural complexity and process costs, circuit-level solutions are often the preferred m...
As semiconductor technology advances in the ultra deep sub -micron era, on-chip global interconnecti...
In the literature, surfing technique has been proposed for single ended wave-pipelined serial interc...
Abstract—This paper describes a novel global on-chip interconnect scheme, in which a one UI-delayed ...
Low-swing on-chip interconnect circuits have been viewed as alternative solutions to the problem of ...
With the rapid increase in transmission speeds of communication systems, the demand for very high-sp...
Abstrnct-The propagation delay of interconnection lines is a major factor in determining the perform...