We investigated the removal of polymers with various chemical structures and the removal of ion-implanted resists using wet ozone. The removal rates of polymers that have carbon-carbon (C–C) double bonds in the main chain were high. The main chain of these polymers may be decomposed. The removal rates of polymers that have C–C double bonds in the side chain were low. The benzene ring in the side chain changes into carboxylic acid, so their ability to dissolve in water increased. The polymers without C–C double bonds were not removed. Removal of B and P ion-implanted resists became difficult with increasing acceleration energy of ions at implantation. The resist with plastic-deformation hardness that was twice as hard as that of nonimplanted...
Despite the past four decades of service experiences with polymeric insulators in power systems all ...
Chemical amplified resists (CAR´s) are widely used in the semiconductor industry very well since its...
An important module of the packaging based on flip-chip is the formation of solder or Cu bumps. Sold...
Part of the Hewlett Packard Components Group`s Product Stewardship program is the ongoing effort to ...
In the processing of integrated circuits, the source and drain of a p-type and n-type complementary ...
Granular Activated Carbon and Activated Carbon Fiber Cloth were oxidized by nitric acid treatment or...
grantor: University of TorontoWithin this study, four developments are presented. First, t...
The wetting property of polymers is very important in different applications such as biomaterials, t...
International audienceThe presence of phthalates in the environment and especially in surface waters...
Chemical systems containing oxidants are widely used at various stages in semiconductor processing, ...
On the way of making efforts to standardize the selection of polymeric materials for high voltage ou...
Resistance to corona discharges and ozone, the well known ageing factors for polymeric materials use...
The study is devoted to the research of the dependence of the processing results of photoresistive f...
This thesis is divided in two independent parts. The work described in the first part involves the d...
It took a few decades before polymeric composite insulators became broadly accepted on the market as...
Despite the past four decades of service experiences with polymeric insulators in power systems all ...
Chemical amplified resists (CAR´s) are widely used in the semiconductor industry very well since its...
An important module of the packaging based on flip-chip is the formation of solder or Cu bumps. Sold...
Part of the Hewlett Packard Components Group`s Product Stewardship program is the ongoing effort to ...
In the processing of integrated circuits, the source and drain of a p-type and n-type complementary ...
Granular Activated Carbon and Activated Carbon Fiber Cloth were oxidized by nitric acid treatment or...
grantor: University of TorontoWithin this study, four developments are presented. First, t...
The wetting property of polymers is very important in different applications such as biomaterials, t...
International audienceThe presence of phthalates in the environment and especially in surface waters...
Chemical systems containing oxidants are widely used at various stages in semiconductor processing, ...
On the way of making efforts to standardize the selection of polymeric materials for high voltage ou...
Resistance to corona discharges and ozone, the well known ageing factors for polymeric materials use...
The study is devoted to the research of the dependence of the processing results of photoresistive f...
This thesis is divided in two independent parts. The work described in the first part involves the d...
It took a few decades before polymeric composite insulators became broadly accepted on the market as...
Despite the past four decades of service experiences with polymeric insulators in power systems all ...
Chemical amplified resists (CAR´s) are widely used in the semiconductor industry very well since its...
An important module of the packaging based on flip-chip is the formation of solder or Cu bumps. Sold...