Add to ORKGThe article analyzes the mutual capacitance and inductance of printed circuit and introduces an evaluation technique for conductor-to-conductor capacitance under electrical connections tracing, the technique based on a multi-layer channel model
A new method is developed to assess the effectiveness of local decoupling capacitors on parallel-pla...
This project work describes on study and analysis of materials characteristics for the capacitive co...
In very high speed IC circuits, the extraction of the self and coupling capacitances of multilayer a...
В статье проанализирована взаимная емкость и индуктивность печатного монтажа, предложен способ оценк...
In multi-layer circuit boards of modern electronic equipment, signal lines and power distribution tr...
Propagation delays and couplings between nearby lines affect the circuit performances (speed, power ...
The physics associated with mutual inductance between vias has been analyzed, and a method has been ...
This paper describes a fast and accurate semi-analytical procedure for determining capacitance and i...
technical reportA novel approach to solving the accurate capacitance and resistance extraction probl...
A printed circuit board via is analyzed as a collection of sections bounded by grounded planes. A se...
In this paperm, we describe the crossover of the parasitic capacitance at the interconnections for t...
Electrification of transportation is a major subject of research today, especially in air travel. Th...
Interdigitated electrode structures have applications in a myriad of fields and have become attracti...
International audienceThis paper proposes a circuit model to calculate the current along printed coi...
The concepts of inductance and partial inductance play a key role in printed circuit board (PCB) mod...
A new method is developed to assess the effectiveness of local decoupling capacitors on parallel-pla...
This project work describes on study and analysis of materials characteristics for the capacitive co...
In very high speed IC circuits, the extraction of the self and coupling capacitances of multilayer a...
В статье проанализирована взаимная емкость и индуктивность печатного монтажа, предложен способ оценк...
In multi-layer circuit boards of modern electronic equipment, signal lines and power distribution tr...
Propagation delays and couplings between nearby lines affect the circuit performances (speed, power ...
The physics associated with mutual inductance between vias has been analyzed, and a method has been ...
This paper describes a fast and accurate semi-analytical procedure for determining capacitance and i...
technical reportA novel approach to solving the accurate capacitance and resistance extraction probl...
A printed circuit board via is analyzed as a collection of sections bounded by grounded planes. A se...
In this paperm, we describe the crossover of the parasitic capacitance at the interconnections for t...
Electrification of transportation is a major subject of research today, especially in air travel. Th...
Interdigitated electrode structures have applications in a myriad of fields and have become attracti...
International audienceThis paper proposes a circuit model to calculate the current along printed coi...
The concepts of inductance and partial inductance play a key role in printed circuit board (PCB) mod...
A new method is developed to assess the effectiveness of local decoupling capacitors on parallel-pla...
This project work describes on study and analysis of materials characteristics for the capacitive co...
In very high speed IC circuits, the extraction of the self and coupling capacitances of multilayer a...