Selective laser melting of pure copper was carried out to obtain crack-free and dense parts for various laser settings. The crystallographic texture measurements at the top surface showed a change in texture type and intensity when laser settings such as hatch spacing, laser power, and laser scan speed were altered. The texture orientation at the vertical side surface was random despite the presence of a strong texture on the top surface. The texture type and the intensity obtained at the top surface is explained using melt pool geometry and solidification morphology (as shown in Figure 1), whereas the random texture orientation obtained at the vertical side surface is due to multiple re-melting and 900 scan rotation applied between the suc...
Pure Copper (Cu) is very difficult to prepare using selective laser melting (SLM) technology. This w...
Selective laser melting of pure copper is challenging because of its high optical reflectivity and t...
This work investigates the use of fine Cu powder, with ~ 20 vol% smaller than 15 μm size, for the s...
International audienceSelective laser melting (SLM) was used to fabricate copper samples under vario...
International audienceSelective laser melting (SLM) was used to fabricate copper samples under vario...
K220 copper parts were produced by Selective Laser Melting (SLM) technology. The relative densities ...
The constantly increasing requirements of critical engineering parts can often be satisfied through ...
The constantly increasing requirements of critical engineering parts can often be satisfied through ...
The paper presents the results of experimental studies of the effect of mechanoactivation of the pow...
In this study, 316L parts were fabricated with the selective laser melting additive layer manufactur...
International audienceIn this study, 316L parts were fabricated with the selective laser melting add...
International audienceIn this study, 316L parts were fabricated with the selective laser melting add...
International audienceIn this study, 316L parts were fabricated with the selective laser melting add...
This work investigates the use of fine Cu powder, with ~ 20 vol% smaller than 15 µm size, for the se...
International audienceIn this study, 316L parts were fabricated with the selective laser melting add...
Pure Copper (Cu) is very difficult to prepare using selective laser melting (SLM) technology. This w...
Selective laser melting of pure copper is challenging because of its high optical reflectivity and t...
This work investigates the use of fine Cu powder, with ~ 20 vol% smaller than 15 μm size, for the s...
International audienceSelective laser melting (SLM) was used to fabricate copper samples under vario...
International audienceSelective laser melting (SLM) was used to fabricate copper samples under vario...
K220 copper parts were produced by Selective Laser Melting (SLM) technology. The relative densities ...
The constantly increasing requirements of critical engineering parts can often be satisfied through ...
The constantly increasing requirements of critical engineering parts can often be satisfied through ...
The paper presents the results of experimental studies of the effect of mechanoactivation of the pow...
In this study, 316L parts were fabricated with the selective laser melting additive layer manufactur...
International audienceIn this study, 316L parts were fabricated with the selective laser melting add...
International audienceIn this study, 316L parts were fabricated with the selective laser melting add...
International audienceIn this study, 316L parts were fabricated with the selective laser melting add...
This work investigates the use of fine Cu powder, with ~ 20 vol% smaller than 15 µm size, for the se...
International audienceIn this study, 316L parts were fabricated with the selective laser melting add...
Pure Copper (Cu) is very difficult to prepare using selective laser melting (SLM) technology. This w...
Selective laser melting of pure copper is challenging because of its high optical reflectivity and t...
This work investigates the use of fine Cu powder, with ~ 20 vol% smaller than 15 μm size, for the s...