Compressively strained Ge long channel ring-type pMOSFETs with high-κ Si/SiO2/HfO2/TiN gate stacks are fabricated on Si0.2Ge0.8 virtual substrates. Effective oxide thickness is approximately 1.4 nm with low gate leakage current. A peak hole mobility of 640 cm2/V · s and up to a four times enhancement over the Si/SiO2 universal curve are observed. Parasitic conduction within the Si-cap layers degrades the mobility at large vertical fields, although up to a 2.5 times enhancement over universal remains at a field of 0.9 MV/cm.status: publishe
Biaxial tensile strained Si grown on SiGe virtual substrates will be incorporated into future genera...
We introduce a strained-SiGe technology adopting different thicknesses of Si cap layers towards low ...
We integrate strained Si channel with HfO2 dielectric and TiN metal gate electrode to demonstrate NM...
Compressively strained Ge long channel ring-type pMOSFETs with high-kappa Si/SiO2/HfO2/TiN gate stac...
International audienceEpitaxial strained Si and Ge n- and p-MOSFETs with a TiN/HfO2 gate stack were ...
Abstract- Operation and fabrication of a new high channel-mobility strained-Si PMOSFET are presented...
To realize high-mobility surface channel pMOSFETs on Ge, a 1.6-nm-thick SiOX passivation layer betwe...
We have fabricated strained Ge channel p-type metal-oxide-semiconductor field-effect transistors (p-...
fabricated via MBE and experimentally characterized from room temperature down to 5K. Mobil-ity enha...
Strained SiGe quantum well p-MOSFETs with LaLuO3 higher-k dielectric were fabricated and characteriz...
The characteristics of Si(0.2)Ge(0.8) channel PFETs fabricated directly on Si (110) surfaces have be...
To reach future low power operation at &le0.5 V, high mobility InGaAs nMOS and Ge pMOS were prop...
Biaxially-strained Ge p-channel field effect transistors (pFETs) have been fabricated for the first ...
We demonstrate for the first time, asymmetrically strained Ge, high-κ/metal gate nanowire (NW) triga...
Short channel p-type metal-oxide-semiconductor field effect transistors (MOSFETs) with GdScO3 gate d...
Biaxial tensile strained Si grown on SiGe virtual substrates will be incorporated into future genera...
We introduce a strained-SiGe technology adopting different thicknesses of Si cap layers towards low ...
We integrate strained Si channel with HfO2 dielectric and TiN metal gate electrode to demonstrate NM...
Compressively strained Ge long channel ring-type pMOSFETs with high-kappa Si/SiO2/HfO2/TiN gate stac...
International audienceEpitaxial strained Si and Ge n- and p-MOSFETs with a TiN/HfO2 gate stack were ...
Abstract- Operation and fabrication of a new high channel-mobility strained-Si PMOSFET are presented...
To realize high-mobility surface channel pMOSFETs on Ge, a 1.6-nm-thick SiOX passivation layer betwe...
We have fabricated strained Ge channel p-type metal-oxide-semiconductor field-effect transistors (p-...
fabricated via MBE and experimentally characterized from room temperature down to 5K. Mobil-ity enha...
Strained SiGe quantum well p-MOSFETs with LaLuO3 higher-k dielectric were fabricated and characteriz...
The characteristics of Si(0.2)Ge(0.8) channel PFETs fabricated directly on Si (110) surfaces have be...
To reach future low power operation at &le0.5 V, high mobility InGaAs nMOS and Ge pMOS were prop...
Biaxially-strained Ge p-channel field effect transistors (pFETs) have been fabricated for the first ...
We demonstrate for the first time, asymmetrically strained Ge, high-κ/metal gate nanowire (NW) triga...
Short channel p-type metal-oxide-semiconductor field effect transistors (MOSFETs) with GdScO3 gate d...
Biaxial tensile strained Si grown on SiGe virtual substrates will be incorporated into future genera...
We introduce a strained-SiGe technology adopting different thicknesses of Si cap layers towards low ...
We integrate strained Si channel with HfO2 dielectric and TiN metal gate electrode to demonstrate NM...