This work presents HiK/metal gate Ge MOSFET devices with a conventional layout and made in a complete Si-like process flow. The fabricated pFET long-channel conventional devices equal the best pFET long-channel mobility results obtained elsewhere on ring-shaped devices made with simplified process flows. The hole mobility is significantly above the Si universal, with a peak mobility value of ∼250 cm² (V s)⁻¹. The fabricated nFET devices have electron mobility much lower than the Si universal, as is commonly observed. Also, deep sub-micron Ge pFET devices with gate lengths below 0.2 μm have been made. The implementation of a novel NiSi-like NiGe module is key to obtain deep sub-micron devices with not only a high-mobility channel, but also w...
As standard silicon CMOS device shrinks to the deep submicron regime, it has become harder and harde...
textSince metal-oxide-semiconductor (MOS) device was first reported around 1959 and utilized for int...
We report the first demonstration of GeSn pMOSFETs. Key highlights of this work also includes a180°C...
Thesis: Ph. D., Massachusetts Institute of Technology, Department of Electrical Engineering and Comp...
Silicon-Germanium (SiGe) is considered to substitute Silicon (Si) as channel material in future CMOS...
The performance of strained silicon (Si) as the channel material for today’s metal-oxide-semiconduct...
As device dimensions are scaled beyond the 45nm node, new device architectures and new materials ne...
CMOS utilizing high mobility III-V/Ge channels on Si substrates is expected to be one of promising d...
The characteristics of Si(0.2)Ge(0.8) channel PFETs fabricated directly on Si (110) surfaces have be...
Integration of Ge as the p-FET channel material for 22 nm and beyond technology nodes is receiving i...
For many decades, the semiconductor industry has miniaturized transistors,delivering increased compu...
textThe scaling of metal-oxide-semiconductor (MOS) field-effect transistors (FETs) has continued for...
A novel subsurface SiGE-channel p-MOSFET is demonstrated in which modulation doping is used to contr...
Power dissipation has become one of the most significant impediments to continued scaling of complem...
fabricated via MBE and experimentally characterized from room temperature down to 5K. Mobil-ity enha...
As standard silicon CMOS device shrinks to the deep submicron regime, it has become harder and harde...
textSince metal-oxide-semiconductor (MOS) device was first reported around 1959 and utilized for int...
We report the first demonstration of GeSn pMOSFETs. Key highlights of this work also includes a180°C...
Thesis: Ph. D., Massachusetts Institute of Technology, Department of Electrical Engineering and Comp...
Silicon-Germanium (SiGe) is considered to substitute Silicon (Si) as channel material in future CMOS...
The performance of strained silicon (Si) as the channel material for today’s metal-oxide-semiconduct...
As device dimensions are scaled beyond the 45nm node, new device architectures and new materials ne...
CMOS utilizing high mobility III-V/Ge channels on Si substrates is expected to be one of promising d...
The characteristics of Si(0.2)Ge(0.8) channel PFETs fabricated directly on Si (110) surfaces have be...
Integration of Ge as the p-FET channel material for 22 nm and beyond technology nodes is receiving i...
For many decades, the semiconductor industry has miniaturized transistors,delivering increased compu...
textThe scaling of metal-oxide-semiconductor (MOS) field-effect transistors (FETs) has continued for...
A novel subsurface SiGE-channel p-MOSFET is demonstrated in which modulation doping is used to contr...
Power dissipation has become one of the most significant impediments to continued scaling of complem...
fabricated via MBE and experimentally characterized from room temperature down to 5K. Mobil-ity enha...
As standard silicon CMOS device shrinks to the deep submicron regime, it has become harder and harde...
textSince metal-oxide-semiconductor (MOS) device was first reported around 1959 and utilized for int...
We report the first demonstration of GeSn pMOSFETs. Key highlights of this work also includes a180°C...