Epitaxial ternary silicide Er0.49Gd0.51Si1.7 layers with a good crystalline quality (chi(min) of Er and Gd is 3.7%) have been formed by 60 keV Er and Gd ion implantation into Si(1 1 1) substrates to a total dose of 1.0 x 10(17)/cm(2) at 450 degrees C using channeled ion beam synthesis (CIBS). The composition, the structure, the strain and the thermal stability of these layers have been studied using energy dispersive spectroscopy (EDS), Rutherford backscattering (RBS)/channeling and X-ray diffraction (XRD). It is shown that the perpendicular and parallel elastic strains of the ET0.49Gd0.51Si1.7 epilayer are e(perpendicular to) = -0.46% +/- 0.02% and e(parallel to) = +0.73% +/- 0.19%. The layer is stable up to 900 degrees C. Annealing at 950...
Amorphous and relaxed epitaxial GeSi films are prepared by Ge-implantation into Si(111) wafers of bo...
The Nd-disilicide, which exists only in a tetragonal or an orthorhombic structure, cannot be grown e...
A continuous buried GdSi1.7 layer is formed by channelled implantation of 90 keV Gd ions into Si(111...
Epitaxial ternary silicide Er0.49Gd0.51Si1.7 layers with a good crystalline quality (chi(min) of Er ...
Si(111) substrates were implanted with 70 or 90 keV Er-166 atoms to doses from 1.3 to 2.0 x 10(17) c...
Si(111) substrates were implanted with 70 or 90 keV 166Er atoms to doses from 1.3 to 2.0??1017 cm-2 ...
ErSi1.7 layers with high crystalline quality (chi(min) of Er is 1.5%) have been formed by 90 keV Er ...
ErSi1.7 layers with high crystalline quality (chi(min) of Er is 1.5%) have been formed by 90 keV Er ...
The ternary silicide, Er0.5Y0.5S1.7 has been produced by channeled ion beam synthesis (CIBS) in a Si...
High quality YSi1.7 layers (chi(min) of Y is 3.5%) have been formed by 60 keV Y ion implantation in ...
High quality YSi1.7 layers (chi(min) of Y is 3.5%) have been formed by 60 keV Y ion implantation in ...
Thin gadolinium silicide layers have been formed by channeled ion beam synthesis. Continuous and het...
Previous reports show that, among all rare-earth silicides, GdSi1.7 is the most difficult one to gro...
Heteroepitaxial ErSi1.7 layers with excellent crystallinity (chi(min) of Er is 1.5%) have been prepa...
The Nd-disilicide, which exists only in a tetragonal or an orthorhombic structure, cannot be grown e...
Amorphous and relaxed epitaxial GeSi films are prepared by Ge-implantation into Si(111) wafers of bo...
The Nd-disilicide, which exists only in a tetragonal or an orthorhombic structure, cannot be grown e...
A continuous buried GdSi1.7 layer is formed by channelled implantation of 90 keV Gd ions into Si(111...
Epitaxial ternary silicide Er0.49Gd0.51Si1.7 layers with a good crystalline quality (chi(min) of Er ...
Si(111) substrates were implanted with 70 or 90 keV Er-166 atoms to doses from 1.3 to 2.0 x 10(17) c...
Si(111) substrates were implanted with 70 or 90 keV 166Er atoms to doses from 1.3 to 2.0??1017 cm-2 ...
ErSi1.7 layers with high crystalline quality (chi(min) of Er is 1.5%) have been formed by 90 keV Er ...
ErSi1.7 layers with high crystalline quality (chi(min) of Er is 1.5%) have been formed by 90 keV Er ...
The ternary silicide, Er0.5Y0.5S1.7 has been produced by channeled ion beam synthesis (CIBS) in a Si...
High quality YSi1.7 layers (chi(min) of Y is 3.5%) have been formed by 60 keV Y ion implantation in ...
High quality YSi1.7 layers (chi(min) of Y is 3.5%) have been formed by 60 keV Y ion implantation in ...
Thin gadolinium silicide layers have been formed by channeled ion beam synthesis. Continuous and het...
Previous reports show that, among all rare-earth silicides, GdSi1.7 is the most difficult one to gro...
Heteroepitaxial ErSi1.7 layers with excellent crystallinity (chi(min) of Er is 1.5%) have been prepa...
The Nd-disilicide, which exists only in a tetragonal or an orthorhombic structure, cannot be grown e...
Amorphous and relaxed epitaxial GeSi films are prepared by Ge-implantation into Si(111) wafers of bo...
The Nd-disilicide, which exists only in a tetragonal or an orthorhombic structure, cannot be grown e...
A continuous buried GdSi1.7 layer is formed by channelled implantation of 90 keV Gd ions into Si(111...