Add to ORKGInternational audienceThis paper outlines the issues related to RF MEMS packaging and low actuation voltage. An original approach is presented concerning the modeling of capacitive contacts using multiphysics simulation and advanced characterization. A similar approach is used concerning packaging development where multi-physics simulations are used to optimize the process. A devoted package architecture is proposed featuring very low loss at microwave range
In this work, a wafer-level packaging solution for RF-MEMS applications that is based on a capping s...
Radio-Frequency Micro-Electro-Mechanical Systems (RF MEMS) are highly miniaturized devices intended ...
In this work, we present electromagnetic optimization of a wafer-level package (WLP) intended for RF...
International audienceThis paper outlines the issues related to RF MEMS packaging and low actuation ...
This dissertation presents a novel zero-level packaging method for shunt, capacitive contact RF MEMS...
Radio-frequency microelectromechanical systems (RF~MEMS) are highly miniaturized devices intended to...
MEMS (Micro Electro-Mechanical System) technology for Radio Frequency (RF) applications has emerged ...
Abstract—This paper presents design of an electrostatic wide band shunt capacitive coupling RF MEMS ...
In RF-MEMS packaging, next to the protection of movable structures, optimization of package electric...
RF MEMS technology shows great promise for wireless communication and other RF applications. However...
In RF-MEMS packaging, next to the protection of movable structures, optimization of package electric...
Abstract—The present paper describes an integrated approach for design, fabrication and encapsulatio...
Radio-Frequency Micro-Electro-Mechanical Systems (RF MEMS) are highly miniaturized devices intended ...
Radio-Frequency Micro-Electro-Mechanical Systems (RF MEMS) are highly miniaturized devices intended ...
Radio-Frequency Micro-Electro-Mechanical Systems (RF MEMS) are highly miniaturized devices intended ...
In this work, a wafer-level packaging solution for RF-MEMS applications that is based on a capping s...
Radio-Frequency Micro-Electro-Mechanical Systems (RF MEMS) are highly miniaturized devices intended ...
In this work, we present electromagnetic optimization of a wafer-level package (WLP) intended for RF...
International audienceThis paper outlines the issues related to RF MEMS packaging and low actuation ...
This dissertation presents a novel zero-level packaging method for shunt, capacitive contact RF MEMS...
Radio-frequency microelectromechanical systems (RF~MEMS) are highly miniaturized devices intended to...
MEMS (Micro Electro-Mechanical System) technology for Radio Frequency (RF) applications has emerged ...
Abstract—This paper presents design of an electrostatic wide band shunt capacitive coupling RF MEMS ...
In RF-MEMS packaging, next to the protection of movable structures, optimization of package electric...
RF MEMS technology shows great promise for wireless communication and other RF applications. However...
In RF-MEMS packaging, next to the protection of movable structures, optimization of package electric...
Abstract—The present paper describes an integrated approach for design, fabrication and encapsulatio...
Radio-Frequency Micro-Electro-Mechanical Systems (RF MEMS) are highly miniaturized devices intended ...
Radio-Frequency Micro-Electro-Mechanical Systems (RF MEMS) are highly miniaturized devices intended ...
Radio-Frequency Micro-Electro-Mechanical Systems (RF MEMS) are highly miniaturized devices intended ...
In this work, a wafer-level packaging solution for RF-MEMS applications that is based on a capping s...
Radio-Frequency Micro-Electro-Mechanical Systems (RF MEMS) are highly miniaturized devices intended ...
In this work, we present electromagnetic optimization of a wafer-level package (WLP) intended for RF...