WOS: 000481733800040In this study, the material properties of CuO thin films fabricated by sputtering technique and electrical properties of CuO/n-Si structure were reported. Temperature-dependent current-voltage (I-V) measurement was carried out to determine the detail electrical characteristics of this structure. The anomaly in thermionic emission (TE) model related to barrier height inhomogeneity at the interface was obtained from the forward bias I-V analysis. The current transport mechanism at the junction was determined under the assumption of TE with Gaussian distribution of barrier height. In this analysis, standard deviation and mean zero bias barrier height were evaluated as 0.176 and 1.48 eV, respectively. Depending on the change...
SummaryAn array of Gold (Au) schottky contacts have been deposited on RF Sputtered nanocrystalline Z...
An array of Gold (Au) schottky contacts have been deposited on RF Sputtered nanocrystalline Zinc Oxi...
Solüsyon-bazlı işlemler, aygıt uygulamaları için malzeme sentezlenmesinde üretim maliyetini indirgem...
In this study, the material properties of CuO thin films fabricated by sputtering technique and elec...
AbstractIn the current paper, the physical properties and microelectronic parameters of direct curre...
In this work, we studied the effect of air-exposed layer on the current-voltage (I-V) capacitance ve...
Here temperature dependent electrical properties of two differently synthesized CuO nanoparticles (h...
WOS: 000458625200001Cu2ZnSnTe4 (CZTTe) thin films with In metal contact were deposited by thermal ev...
Current-voltage (I-V) measurements combined with analytical calculations have been used to explain m...
Electronic properties of Au/V2O5/n-Si Schottky device have been investigated by temperature dependen...
In this work the structural, electrical and optical Properties of CuO semiconductor films had been ...
The research described in this thesis was carried out in the context of an attempt to develop a new ...
The current-voltage characteristics of Cu-nMoSe2 Schottky diodes measured over a wide temperature ra...
Derived from the traditional dichalcogenide CuS structure, ternary transition metal chalcogenide nan...
© . This manuscript version is made available under the CC-BY-NC-ND 4.0 license http://creativecommo...
SummaryAn array of Gold (Au) schottky contacts have been deposited on RF Sputtered nanocrystalline Z...
An array of Gold (Au) schottky contacts have been deposited on RF Sputtered nanocrystalline Zinc Oxi...
Solüsyon-bazlı işlemler, aygıt uygulamaları için malzeme sentezlenmesinde üretim maliyetini indirgem...
In this study, the material properties of CuO thin films fabricated by sputtering technique and elec...
AbstractIn the current paper, the physical properties and microelectronic parameters of direct curre...
In this work, we studied the effect of air-exposed layer on the current-voltage (I-V) capacitance ve...
Here temperature dependent electrical properties of two differently synthesized CuO nanoparticles (h...
WOS: 000458625200001Cu2ZnSnTe4 (CZTTe) thin films with In metal contact were deposited by thermal ev...
Current-voltage (I-V) measurements combined with analytical calculations have been used to explain m...
Electronic properties of Au/V2O5/n-Si Schottky device have been investigated by temperature dependen...
In this work the structural, electrical and optical Properties of CuO semiconductor films had been ...
The research described in this thesis was carried out in the context of an attempt to develop a new ...
The current-voltage characteristics of Cu-nMoSe2 Schottky diodes measured over a wide temperature ra...
Derived from the traditional dichalcogenide CuS structure, ternary transition metal chalcogenide nan...
© . This manuscript version is made available under the CC-BY-NC-ND 4.0 license http://creativecommo...
SummaryAn array of Gold (Au) schottky contacts have been deposited on RF Sputtered nanocrystalline Z...
An array of Gold (Au) schottky contacts have been deposited on RF Sputtered nanocrystalline Zinc Oxi...
Solüsyon-bazlı işlemler, aygıt uygulamaları için malzeme sentezlenmesinde üretim maliyetini indirgem...