International audienceIn the field of microelectronics, due to their high intrinsic mobility, germanium (Ge) and III-V semiconductors appear as promising alternative channel materials to replace silicon in the next generation of high mobility and high frequency transistors. However, contrary to silicon dioxide, those material oxides are neither stable nor of good quality. Preparing proper interfacial layer allowing to passivate and insulate Ge and III-V is one of the challenges still needed to be addressed. A promising way consists in using self-assembled molecular monolayers (SAMs) with a high dielectric constant, since it leads to uniform and nanostructurally well-defined robust thin film over large areas. It has been developed on silicon...