International audienceHeavy doping of Ge is crucial for several advanced micro-and optoelectronic applications, but, at the same time, it still remains extremely challenging. Ge heavily n-type doped at a concentration of 1 X 10(20) cm(-3) by As ion implantation and melting laser thermal annealing (LTA) is shown here to be highly metastable. Upon post-LTA conventional thermal annealing As electrically deactivates already at 350 degrees C reaching an active concentration of similar to 4 x 10(19) cm(-3). No significant As diffusion is detected up to 450 degrees C, where the As activation decreases further to similar to 3 x 10(19) cm(-3). The reason for the observed detrimental deactivation was investigated by Atom Probe Tomography and in situ ...
Highly scaled nanoelectronics requires effective channel doping above 5 Ã 1019cm-3together with ohmi...
Highly scaled nanoelectronics requires effective channel doping above 5 Ã 1019cm-3together with ohmi...
Highly scaled nanoelectronics requires effective channel doping above 5 Ã 1019cm-3together with ohmi...
International audienceHeavy doping of Ge is crucial for several advanced micro-and optoelectronic ap...
The diffusion and activation of arsenic implanted into germanium at 40 keV with maximum concentratio...
Germanium is the main candidate for replacing silicon in active regions in future complementary meta...
International audienceIn this paper, state-of-the-art laser thermal anneal-ing is used to fabricate ...
The microscopic mechanisms involving dopants, contaminants, and defects in Ge during pulsed melting ...
International audienceIn this paper, state-of-the-art laser thermal anneal-ing is used to fabricate ...
The high charge carrier mobility or the peculiar energy bandgap structure, along with the compatibil...
An experimental and theoretical study of the effect of excimer laser annealing (ELA) on B redistribu...
International audienceThe microscopic mechanisms involving dopants, contaminants, and defects in Ge ...
International audienceThe microscopic mechanisms involving dopants, contaminants, and defects in Ge ...
International audienceDefect evolution and dopant activation are intimately related to the use of io...
International audienceDefect evolution and dopant activation are intimately related to the use of io...
Highly scaled nanoelectronics requires effective channel doping above 5 Ã 1019cm-3together with ohmi...
Highly scaled nanoelectronics requires effective channel doping above 5 Ã 1019cm-3together with ohmi...
Highly scaled nanoelectronics requires effective channel doping above 5 Ã 1019cm-3together with ohmi...
International audienceHeavy doping of Ge is crucial for several advanced micro-and optoelectronic ap...
The diffusion and activation of arsenic implanted into germanium at 40 keV with maximum concentratio...
Germanium is the main candidate for replacing silicon in active regions in future complementary meta...
International audienceIn this paper, state-of-the-art laser thermal anneal-ing is used to fabricate ...
The microscopic mechanisms involving dopants, contaminants, and defects in Ge during pulsed melting ...
International audienceIn this paper, state-of-the-art laser thermal anneal-ing is used to fabricate ...
The high charge carrier mobility or the peculiar energy bandgap structure, along with the compatibil...
An experimental and theoretical study of the effect of excimer laser annealing (ELA) on B redistribu...
International audienceThe microscopic mechanisms involving dopants, contaminants, and defects in Ge ...
International audienceThe microscopic mechanisms involving dopants, contaminants, and defects in Ge ...
International audienceDefect evolution and dopant activation are intimately related to the use of io...
International audienceDefect evolution and dopant activation are intimately related to the use of io...
Highly scaled nanoelectronics requires effective channel doping above 5 Ã 1019cm-3together with ohmi...
Highly scaled nanoelectronics requires effective channel doping above 5 Ã 1019cm-3together with ohmi...
Highly scaled nanoelectronics requires effective channel doping above 5 Ã 1019cm-3together with ohmi...