Delay testing has become increasingly essential as chip geometries shrink [1,2,3]. Low overhead or cost effective delay test methodology is successful when it results in a minimal number of effective tests and eases the demands on an already burdened IC design and test staff. This paper describes one successful method in use by IBM ASICs that resulted in a slight total test pattern increase, generally ranging between 10 and 90%. Example ICs showed a pattern increase of as little as 14 % from the stuck-at fault baseline with a transition fault coverage of 89%. In an ASIC business, a large number of ICs are processed, which does not allow for the personnel to understand how to test each individual IC design in detail. Instead, design automati...
Timing-related defects are a major cause for test escapes and field returns for very-deep-sub-micron...
The semiconductor industry has widely accepted transition delay fault (TDF) and path delay fault (PD...
As manufacturing technology scales down to 65nm and below, fabricated chips are becoming increasingl...
The economic testing of high-speed digital ICs is becoming increasingly problematic. Even advanced, ...
2018-10-30The use of bundled-data and bundled-data resilient design with programmable delay lines ha...
UnrestrictedAs VLSI fabrication process continues to advance and device and interconnect dimensions ...
The scaling of fabrication technology not only provides us higher integration and enhanced performan...
Delay testing is one of key processes in production test to ensure high quality and high reliability...
Abstract — With increasing process fluctuations in nano-scale technology, testing for delay faults i...
To meet the market demand, next generation of technology appears with increasing speed and performan...
Abstract—A novel integrated approach for delay-fault testing in external (automatic-test-equipment-b...
<p>Timing-related defects are becoming increasingly important in nanometer-technology integrated cir...
As technology scales down, digital VLSI circuits are prone to many manufacturing defects. These defe...
With the continued down-scaling of IC technology and increase in manufacturing process variations, i...
textThe rapidly evolving process technologies and device complexity that have fueled the exponentia...
Timing-related defects are a major cause for test escapes and field returns for very-deep-sub-micron...
The semiconductor industry has widely accepted transition delay fault (TDF) and path delay fault (PD...
As manufacturing technology scales down to 65nm and below, fabricated chips are becoming increasingl...
The economic testing of high-speed digital ICs is becoming increasingly problematic. Even advanced, ...
2018-10-30The use of bundled-data and bundled-data resilient design with programmable delay lines ha...
UnrestrictedAs VLSI fabrication process continues to advance and device and interconnect dimensions ...
The scaling of fabrication technology not only provides us higher integration and enhanced performan...
Delay testing is one of key processes in production test to ensure high quality and high reliability...
Abstract — With increasing process fluctuations in nano-scale technology, testing for delay faults i...
To meet the market demand, next generation of technology appears with increasing speed and performan...
Abstract—A novel integrated approach for delay-fault testing in external (automatic-test-equipment-b...
<p>Timing-related defects are becoming increasingly important in nanometer-technology integrated cir...
As technology scales down, digital VLSI circuits are prone to many manufacturing defects. These defe...
With the continued down-scaling of IC technology and increase in manufacturing process variations, i...
textThe rapidly evolving process technologies and device complexity that have fueled the exponentia...
Timing-related defects are a major cause for test escapes and field returns for very-deep-sub-micron...
The semiconductor industry has widely accepted transition delay fault (TDF) and path delay fault (PD...
As manufacturing technology scales down to 65nm and below, fabricated chips are becoming increasingl...