Abstruct- Technology trends and especially portable applications drive the quest for low-power VLSI design. Solutions that involve algorithmic, structural or physical transformations are sought. The focus is on developing low-power circuits without affecting too much the performance (area, latency, period). For CMOS circuits most power is dissipated as dynamic power for charging and discharging node capacitances. This is why many promising results in low-power design are obtained by minimizing the number of transitions inside the CMOS circuit. While it is generally accepted that because of the large capacitances involved much of the power dissipated by an IC is at the U0 little has been specifically done for decreasing the U0 power dissipat...
In this paper we present a simplified model for deep submicron, on-chip, parallel data buses. Using ...
University of Minnesota Ph.D. dissertation. November 2008. Major: Electrical Engineering. Advisor: G...
Coupling effects between on-chip interconnects must be addressed in ultra deep submicron VLSI and sy...
The two main sources of power dissipation in CMOS circuits are static current, which results from re...
Power dissipation is an important design constraint in today’s CMOS VLSI design and is addressed wid...
Low power VLSI circuit design is one of the most important issues in present day technology. One of ...
Transitions on high capacitance busses in VLSI systems result in considerable power dissipation. Var...
Dynamic power dissipation on I/O buses is an important issue for high-speed communication between ch...
We present a partial bus-invert coding scheme for power optimization of system level bus. In the pro...
Now a day’s VLSI has become the backbone of all types of designs. Interconnect plays an increasing r...
This paper describes a novel low-power coding methodology for buses. Ultra deep submicron technology...
This paper presents two bus coding schemes for power optimization of application-specific systems: ...
System on–chip design in deep submicron technology interconnects plays an important role in overall ...
136 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2001.Since intermodule buses and i...
Technology trends and especially portable applications are adding a third dimension (power) to the p...
In this paper we present a simplified model for deep submicron, on-chip, parallel data buses. Using ...
University of Minnesota Ph.D. dissertation. November 2008. Major: Electrical Engineering. Advisor: G...
Coupling effects between on-chip interconnects must be addressed in ultra deep submicron VLSI and sy...
The two main sources of power dissipation in CMOS circuits are static current, which results from re...
Power dissipation is an important design constraint in today’s CMOS VLSI design and is addressed wid...
Low power VLSI circuit design is one of the most important issues in present day technology. One of ...
Transitions on high capacitance busses in VLSI systems result in considerable power dissipation. Var...
Dynamic power dissipation on I/O buses is an important issue for high-speed communication between ch...
We present a partial bus-invert coding scheme for power optimization of system level bus. In the pro...
Now a day’s VLSI has become the backbone of all types of designs. Interconnect plays an increasing r...
This paper describes a novel low-power coding methodology for buses. Ultra deep submicron technology...
This paper presents two bus coding schemes for power optimization of application-specific systems: ...
System on–chip design in deep submicron technology interconnects plays an important role in overall ...
136 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2001.Since intermodule buses and i...
Technology trends and especially portable applications are adding a third dimension (power) to the p...
In this paper we present a simplified model for deep submicron, on-chip, parallel data buses. Using ...
University of Minnesota Ph.D. dissertation. November 2008. Major: Electrical Engineering. Advisor: G...
Coupling effects between on-chip interconnects must be addressed in ultra deep submicron VLSI and sy...