As the impact of process variations become increasingly significant in ultra deep submicron technologies, FinFETs are becoming increasingly popular a contender for replacement of bulk FETs due to favorable device characteristics. This paper explores the impacts of random and systematic process variations on SRAM cell stability and timing. The largest contributors to these robustness and timing metrics are identified. Design tradeoffs are explored in optimizing the SRAM cell for increased stability and timing.
In this paper we illustrate how by using advanced atomistic TCAD tools the interplay between long-ra...
This paper presents a comprehensive statistical variability study of 14-nm technology node SOI FinFE...
This paper presents an evaluation of 14-nm SOI FinFET CMOS SRAM codesign techniques in the presence ...
Abstract—This paper analyzes the impacts of intrinsic process variations and negative bias temperatu...
3-D mixed-mode device-circuit simulation is presented to investigate stochastic mismatch of FinFETs ...
Design variability due to inter-die (D2D) and intra-die (WID) process variations has the potential t...
While traditional scaling used to be accompanied by an improvement in device performance, this is mu...
Variability is a critical concern for the stability and yield of SRAM with minimized size. We prese...
Continued increase in the process variability is perceived to be a major roadblock for future techno...
This paper analyses standard 6T and 7T SRAM (static random access memory) eell in light ol` process,...
Robust SRAM design is one of the key challenges of process technology scaling. The steady pace of pr...
Driven by the improvements on performance and cost, new generations of complementary metal oxide sem...
ABSTRACT: This paper analyses standard 6T and 7T SRAM (static random access memory) cell in light o...
The impact of fin line-edge roughness on threshold voltage and drive current of LSTP-32nm Fin-FETs i...
We report a systematic study on the impact of process and statistical variability on SRAM design in ...
In this paper we illustrate how by using advanced atomistic TCAD tools the interplay between long-ra...
This paper presents a comprehensive statistical variability study of 14-nm technology node SOI FinFE...
This paper presents an evaluation of 14-nm SOI FinFET CMOS SRAM codesign techniques in the presence ...
Abstract—This paper analyzes the impacts of intrinsic process variations and negative bias temperatu...
3-D mixed-mode device-circuit simulation is presented to investigate stochastic mismatch of FinFETs ...
Design variability due to inter-die (D2D) and intra-die (WID) process variations has the potential t...
While traditional scaling used to be accompanied by an improvement in device performance, this is mu...
Variability is a critical concern for the stability and yield of SRAM with minimized size. We prese...
Continued increase in the process variability is perceived to be a major roadblock for future techno...
This paper analyses standard 6T and 7T SRAM (static random access memory) eell in light ol` process,...
Robust SRAM design is one of the key challenges of process technology scaling. The steady pace of pr...
Driven by the improvements on performance and cost, new generations of complementary metal oxide sem...
ABSTRACT: This paper analyses standard 6T and 7T SRAM (static random access memory) cell in light o...
The impact of fin line-edge roughness on threshold voltage and drive current of LSTP-32nm Fin-FETs i...
We report a systematic study on the impact of process and statistical variability on SRAM design in ...
In this paper we illustrate how by using advanced atomistic TCAD tools the interplay between long-ra...
This paper presents a comprehensive statistical variability study of 14-nm technology node SOI FinFE...
This paper presents an evaluation of 14-nm SOI FinFET CMOS SRAM codesign techniques in the presence ...