Technology trends, driven by the desire for higher transistor densities and faster devices, have led to transistor dimensions scaling into the nanometre regime. However, with this continued scaling, digital Integrated Circuits (ICs) have faced many challenges that include: increased leakage power dissipation, increased process variations of transistor parameters and increased sensitivity of ICs to ionizing radiation from terrestrial and cosmic sources. These challenges are having a significant effect on circuit performance and power, making it more difficult to design circuits that achieve a required specification. This thesis presents new techniques for addressing these challenges in digital circuits. First, a new Static Random Access Memo...
This thesis explores means of mitigating the effects of silicon variation on SRAM by means of circui...
increases and most of the power is dissipated as leakage. Leakage power reduction is achieved in Sta...
Scaling devices while maintaining reasonable short channel immunity requires gate oxide thickness of...
Aggressive CMOS scaling results in lower threshold voltage and thin oxide thickness for transistors\...
Abstract — The leakage power can dominate the system power dissipation and determine the battery lif...
Abstract The leakage power can dominate the system power dissipation and determine the battery lif...
Aggressive scaling of transistor dimensions with each technology generation has resulted in increase...
As the technology in electronic circuits is improving, the complexity in these circuits also increas...
As the CMOS technology continues to scale down, power dissipation and robustness to leakage and proc...
Abstract — The growing demand for high density VLSI circuits and the exponential dependency of the l...
As the technology in electronic circuits is improving, the complexity in these circuits also increas...
As the CMOS technology continues to scale down to achieve higher performance, considerable power dis...
SRAM data stability and leakage currents are major concerns in nanometer CMOS technologies. The prim...
In this paper, it is attempted to analyze the power performances of few CMOS digital circuits such a...
Abstract—Semiconductor manufacturing process scaling increases leakage and transistor variations, bo...
This thesis explores means of mitigating the effects of silicon variation on SRAM by means of circui...
increases and most of the power is dissipated as leakage. Leakage power reduction is achieved in Sta...
Scaling devices while maintaining reasonable short channel immunity requires gate oxide thickness of...
Aggressive CMOS scaling results in lower threshold voltage and thin oxide thickness for transistors\...
Abstract — The leakage power can dominate the system power dissipation and determine the battery lif...
Abstract The leakage power can dominate the system power dissipation and determine the battery lif...
Aggressive scaling of transistor dimensions with each technology generation has resulted in increase...
As the technology in electronic circuits is improving, the complexity in these circuits also increas...
As the CMOS technology continues to scale down, power dissipation and robustness to leakage and proc...
Abstract — The growing demand for high density VLSI circuits and the exponential dependency of the l...
As the technology in electronic circuits is improving, the complexity in these circuits also increas...
As the CMOS technology continues to scale down to achieve higher performance, considerable power dis...
SRAM data stability and leakage currents are major concerns in nanometer CMOS technologies. The prim...
In this paper, it is attempted to analyze the power performances of few CMOS digital circuits such a...
Abstract—Semiconductor manufacturing process scaling increases leakage and transistor variations, bo...
This thesis explores means of mitigating the effects of silicon variation on SRAM by means of circui...
increases and most of the power is dissipated as leakage. Leakage power reduction is achieved in Sta...
Scaling devices while maintaining reasonable short channel immunity requires gate oxide thickness of...