This paper presents the architecture of a high-performance intermediate-level memory subsystem. The memory subsystem is designed to narrow the growing gap between processors’ cycle time and the round-trip delay to main memory. The system is built from high-performance DRAM arrays and SRAM buffers, both integrated on the same IC. We call these parts Integrated Static and Dynamic Random Access Memory (ISDRAM). The ISDRAM system is configured as a very large cache and can be implemented either as an on-chip cache integrated with the CPU, or as a much larger external cache. We show that building very large caches can be an effective way to narrow the growing CPU-memory speed gap. Building a cache as a combination of DRAM and SRAM yields a syste...
Memory (cache, DRAM, and disk) is in charge of providing data and instructions to a computer\u27s pr...
textContemporary DRAM systems have maintained impressive scaling by managing a careful balance betwe...
Advancements in packaging technology enable high-bandwidth 3D-DRAM that mitigates the memory bandwid...
Computer memory is organized into a hierarchy. At the highest level are the processor registers, nex...
The RAMpage memory hierarchy is an attempt at devising a comprehensive strategy to address the grow...
Memory interconnect has become increasingly important for the electronics community since memory acc...
textOne of the major limiters to computer systems and systems on chip (SOC) designs is accessing the...
A microprocessor integrated with DRAM on the same die has the potential to improve system performanc...
The gap between CPU and main memory speeds has long been a performance bottleneck. As we move toward...
Dynamic Random Access Memories (DRAM) are the dominant solid-state memory devices used for primary m...
The RAMpage memory hierarchy is an attempt at devising a comprehensive strategy to address the growi...
Static Random Access Memory (SRAM)- based cache is one of the most important components of state-of-...
A microprocessor integrated with DRAM on the same die has the potential to improve system performanc...
Summarization: By examining the rate at which successive generations of processor and DRAM cycle tim...
Die-stacking is a new technology that allows multiple integrated circuits to be stacked on top of ea...
Memory (cache, DRAM, and disk) is in charge of providing data and instructions to a computer\u27s pr...
textContemporary DRAM systems have maintained impressive scaling by managing a careful balance betwe...
Advancements in packaging technology enable high-bandwidth 3D-DRAM that mitigates the memory bandwid...
Computer memory is organized into a hierarchy. At the highest level are the processor registers, nex...
The RAMpage memory hierarchy is an attempt at devising a comprehensive strategy to address the grow...
Memory interconnect has become increasingly important for the electronics community since memory acc...
textOne of the major limiters to computer systems and systems on chip (SOC) designs is accessing the...
A microprocessor integrated with DRAM on the same die has the potential to improve system performanc...
The gap between CPU and main memory speeds has long been a performance bottleneck. As we move toward...
Dynamic Random Access Memories (DRAM) are the dominant solid-state memory devices used for primary m...
The RAMpage memory hierarchy is an attempt at devising a comprehensive strategy to address the growi...
Static Random Access Memory (SRAM)- based cache is one of the most important components of state-of-...
A microprocessor integrated with DRAM on the same die has the potential to improve system performanc...
Summarization: By examining the rate at which successive generations of processor and DRAM cycle tim...
Die-stacking is a new technology that allows multiple integrated circuits to be stacked on top of ea...
Memory (cache, DRAM, and disk) is in charge of providing data and instructions to a computer\u27s pr...
textContemporary DRAM systems have maintained impressive scaling by managing a careful balance betwe...
Advancements in packaging technology enable high-bandwidth 3D-DRAM that mitigates the memory bandwid...