Abstract. In this paper, we propose a temperature-aware DFS (Dynamic Frequency Scaling) technique using the performance counters that is already embedded in the commercial microprocessors. By using performance counters and simple regression analysis, we can predict the localized temperature and efficiently schedule the tasks considering the temperature. The proposed technique is especially beneficial to potential localized thermal problems that are inevitable due to limited number of costly CMOS thermal sensors. When localized thermal problems that were not detected by thermal sensors are found after fabrication, the thermal problems can be avoided by the proposed software solution without re-fabrication costs. The evaluation results show t...
With extensive use of battery powered devices such as smartphones, laptops and tablets energy effici...
Ever increasing microprocessor power densities has brought temperature-aware microarchitecture resea...
Abstract — Embedded devices using highly integrated circuits must cope with conflicting constraints....
A conventional technique to rise temperature in a processor involves the usage of thermal ovens or i...
With continuous IC(Integrated Circuit) technology size scaling, more and more transistors are integr...
As energy consumption in high-performance systems has increased, thermal management has become a big...
The power consumption of a high-end microprocessor increases very rapidly. High power consumption wi...
With chip temperature being a major hurdle in microprocessor design, techniques to recover the perfo...
As energy consumption in high-performance systems has increased, thermal management has become a big...
The increment in computing power of embedded processors has fueled a revolution in many application ...
Constant increase in performance demands, more aggressive technology scaling and higher transistor i...
The power density of microprocessor chips continues to rise due to the growing demand on microproces...
Abstract—Increasing number of cores and clock speeds on a smaller chip area implies more heat dissip...
Abstract—In the past, dynamic voltage and frequency scaling (DVFS) has been widely used for power an...
Over the last few decades, chip performance has increased steadily due to continuous and aggressive ...
With extensive use of battery powered devices such as smartphones, laptops and tablets energy effici...
Ever increasing microprocessor power densities has brought temperature-aware microarchitecture resea...
Abstract — Embedded devices using highly integrated circuits must cope with conflicting constraints....
A conventional technique to rise temperature in a processor involves the usage of thermal ovens or i...
With continuous IC(Integrated Circuit) technology size scaling, more and more transistors are integr...
As energy consumption in high-performance systems has increased, thermal management has become a big...
The power consumption of a high-end microprocessor increases very rapidly. High power consumption wi...
With chip temperature being a major hurdle in microprocessor design, techniques to recover the perfo...
As energy consumption in high-performance systems has increased, thermal management has become a big...
The increment in computing power of embedded processors has fueled a revolution in many application ...
Constant increase in performance demands, more aggressive technology scaling and higher transistor i...
The power density of microprocessor chips continues to rise due to the growing demand on microproces...
Abstract—Increasing number of cores and clock speeds on a smaller chip area implies more heat dissip...
Abstract—In the past, dynamic voltage and frequency scaling (DVFS) has been widely used for power an...
Over the last few decades, chip performance has increased steadily due to continuous and aggressive ...
With extensive use of battery powered devices such as smartphones, laptops and tablets energy effici...
Ever increasing microprocessor power densities has brought temperature-aware microarchitecture resea...
Abstract — Embedded devices using highly integrated circuits must cope with conflicting constraints....