Add to ORKGbegun to make manufacturing 3D chips a reality. For 3D designs to achieve their full potential, it is imperative to develop effective physical design strategies that handle the complexities and new objectives specific to 3D designs. We present two frameworks of placement and routing techniques, for 3D FPGA and for 3D standard cell based designs, respectively. Our method addresses wire length, delay and area minimization, as well as thermal optimization during placement and routing phases. These two flows have been used to obtain optimized layouts for benchmarks with upto 8000 FPGA blocks and tens of thousands of standard cells, respectively. I
An FPGA has a finite routing capacity due to which a fair number of highly dense circuits fail to ma...
Nowadays, placement problems become more complex since they need to consider standard cells, mixed s...
Modern semiconductor manufacturing facilitates single-chip electronic systems that only five years a...
Abstract. In current reconfigurable architectures, the interconnect structures increasingly contribu...
Perhaps the most challenging part of implementing a new FPGA architecture is developing an appropria...
Abstract — A software-supported systematic methodology for exploring and evaluating alternative 3D r...
Power becomes an ever-increasing concern due to the growing design complexity and the shrinking proc...
grantor: University of TorontoIn the thirteen years since their introduction, Field-Progra...
As the field programmable gate array (FPGA) industry grows device capacity with Moore's law and exp...
With the rapid advance of enabling technologies, the era of 3D ICs is near. Yet, there are several p...
The complexity of design process is increasing proportionally with continuous advancement in the In...
This paper introduces a software supported methodology for exploring/evaluating 3D FPGA architecture...
With aggressive scaling of semiconductor manufacturing technology in recent decades, the complexity ...
In this work, the benefits of using 3-D integration in the fabrication of Field Pro-grammable Gate A...
10.1109/FPT.2013.6718325FPT 2013 - Proceedings of the 2013 International Conference on Field Program...
An FPGA has a finite routing capacity due to which a fair number of highly dense circuits fail to ma...
Nowadays, placement problems become more complex since they need to consider standard cells, mixed s...
Modern semiconductor manufacturing facilitates single-chip electronic systems that only five years a...
Abstract. In current reconfigurable architectures, the interconnect structures increasingly contribu...
Perhaps the most challenging part of implementing a new FPGA architecture is developing an appropria...
Abstract — A software-supported systematic methodology for exploring and evaluating alternative 3D r...
Power becomes an ever-increasing concern due to the growing design complexity and the shrinking proc...
grantor: University of TorontoIn the thirteen years since their introduction, Field-Progra...
As the field programmable gate array (FPGA) industry grows device capacity with Moore's law and exp...
With the rapid advance of enabling technologies, the era of 3D ICs is near. Yet, there are several p...
The complexity of design process is increasing proportionally with continuous advancement in the In...
This paper introduces a software supported methodology for exploring/evaluating 3D FPGA architecture...
With aggressive scaling of semiconductor manufacturing technology in recent decades, the complexity ...
In this work, the benefits of using 3-D integration in the fabrication of Field Pro-grammable Gate A...
10.1109/FPT.2013.6718325FPT 2013 - Proceedings of the 2013 International Conference on Field Program...
An FPGA has a finite routing capacity due to which a fair number of highly dense circuits fail to ma...
Nowadays, placement problems become more complex since they need to consider standard cells, mixed s...
Modern semiconductor manufacturing facilitates single-chip electronic systems that only five years a...