A compact model for RLC interconnect lines, in the form of a twopath hybrid ladder, is proposed for on-chip interconnect timing and noise analysis. The model parameters are synthesized through constrained nonlinear optimization to directly match the circuit response characteristics over a range of transition times and loads, both at the driving point and at the receiver end. The effect of capacitances on the return current distribution is explicitly considered in our work in obtaining the accurate responses for industrial circuits, and is found to have a significant effect. The parameters for this model are embedded in a table that is characterized once for a design and then used for the analysis of various structured interconnects. Compare...
Abstract—Novel compact expressions that describe the transient response of a high-speed distributed ...
In this paper we have put forward an analytical model, which could accurately capture the on chip in...
This paper presents a two-step, RC-interconnect in-sensitive linear time-varying (LTV) driver model ...
Abstract: For improved efficiency, static timing analyzers represent the interconnect driving point ...
UnrestrictedThis dissertation investigates the effect of capacitive crosstalk on interconnect and lo...
Timing driven physical design, synthesis, and optimization tools need efficient closed-form delay mo...
This work presents a methodology for creating efficient yet accurate timing macromodels which are te...
The scaling of integrated circuit (IC) technologies to the nanometer regime has resulted in various ...
Today’s VLSI networks demands for high speed. And in this work the compact form mathematical model f...
The scaling of integrated circuit (IC) technologies to the nanometer regime has resulted in various ...
This paper describes a novel technique to analyze the effects of supply voltage noise on circuit del...
Received 30-12-2012, revised 26-02-2013, online 12-03-2013 With the advancement of high frequency in...
The common methods for interconnect delay estimation rely upon an RC tree model. These methods are n...
Chip size shrinks as a result of VLSI's aggressive technology scaling. In a number of ways, this ong...
In today’s UDSM(ultra-deep-sub-micron)-process-technology-based ICs, dynamic delay variations of str...
Abstract—Novel compact expressions that describe the transient response of a high-speed distributed ...
In this paper we have put forward an analytical model, which could accurately capture the on chip in...
This paper presents a two-step, RC-interconnect in-sensitive linear time-varying (LTV) driver model ...
Abstract: For improved efficiency, static timing analyzers represent the interconnect driving point ...
UnrestrictedThis dissertation investigates the effect of capacitive crosstalk on interconnect and lo...
Timing driven physical design, synthesis, and optimization tools need efficient closed-form delay mo...
This work presents a methodology for creating efficient yet accurate timing macromodels which are te...
The scaling of integrated circuit (IC) technologies to the nanometer regime has resulted in various ...
Today’s VLSI networks demands for high speed. And in this work the compact form mathematical model f...
The scaling of integrated circuit (IC) technologies to the nanometer regime has resulted in various ...
This paper describes a novel technique to analyze the effects of supply voltage noise on circuit del...
Received 30-12-2012, revised 26-02-2013, online 12-03-2013 With the advancement of high frequency in...
The common methods for interconnect delay estimation rely upon an RC tree model. These methods are n...
Chip size shrinks as a result of VLSI's aggressive technology scaling. In a number of ways, this ong...
In today’s UDSM(ultra-deep-sub-micron)-process-technology-based ICs, dynamic delay variations of str...
Abstract—Novel compact expressions that describe the transient response of a high-speed distributed ...
In this paper we have put forward an analytical model, which could accurately capture the on chip in...
This paper presents a two-step, RC-interconnect in-sensitive linear time-varying (LTV) driver model ...