In this paper, we study the interconnect layout optimization problem under a higher order resistance--inductance--capacitance model to optimize not only delay, but also waveform for interconnects with nonmonotone signal response in the context of multipchip-module global routing. We propose a unified approach that considers topology optimization and waveform optimization simultaneously. Using a new incremental moment-computation algorithm, we interleave topology construction with moment computation to facilitate accurate delay calculation and evaluation of waveform quality. Our algorithm considers a large class of routing topologies, ranging from shortest path Steiner trees to bounded-radius Steiner trees and Steiner routings. We construct ...
Most existing performance-driven and clock routing algorithms construct optimal routing topology for...
Given a multilayer routing area, we consider the global routing problem of selecting a maximum set o...
With the exponential reduction in the scaling of feature size, inter-wire coupling capacitance becom...
In this paper, we study the interconnect layout optimization problem under a higher-order RLC model ...
In this paper, we study the interconnect layout optimization problem under a higher-order RLC model ...
Motivated by analysis of distributed RC delay in routing trees, we propose a new tree construction f...
As the CMOS technology enters the very deep submicron era, inter-wire coupling capacitance becomes t...
This paper presents a sensitivity-based wiresizing algorithm for interconnect delay optimization of ...
172 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1993.This thesis deals with four p...
Abstract | Deep sub-micron e ects, along with increasing interconnect densities, have increased the ...
Existing routing problems for delay minimization consider the connection of a single source node to ...
The multi-net Global Routing Problem (GRP) in VLSI physical design is a problem of routing a set of ...
This paper proposes a framework for (signal) interconnect power optimization at the global routing s...
In this thesis algorithms for solving performance-driven chip floorplanning and global routing probl...
In this paper, we study the optimal wiresizing problem under the distributed Elmore delay model. We ...
Most existing performance-driven and clock routing algorithms construct optimal routing topology for...
Given a multilayer routing area, we consider the global routing problem of selecting a maximum set o...
With the exponential reduction in the scaling of feature size, inter-wire coupling capacitance becom...
In this paper, we study the interconnect layout optimization problem under a higher-order RLC model ...
In this paper, we study the interconnect layout optimization problem under a higher-order RLC model ...
Motivated by analysis of distributed RC delay in routing trees, we propose a new tree construction f...
As the CMOS technology enters the very deep submicron era, inter-wire coupling capacitance becomes t...
This paper presents a sensitivity-based wiresizing algorithm for interconnect delay optimization of ...
172 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1993.This thesis deals with four p...
Abstract | Deep sub-micron e ects, along with increasing interconnect densities, have increased the ...
Existing routing problems for delay minimization consider the connection of a single source node to ...
The multi-net Global Routing Problem (GRP) in VLSI physical design is a problem of routing a set of ...
This paper proposes a framework for (signal) interconnect power optimization at the global routing s...
In this thesis algorithms for solving performance-driven chip floorplanning and global routing probl...
In this paper, we study the optimal wiresizing problem under the distributed Elmore delay model. We ...
Most existing performance-driven and clock routing algorithms construct optimal routing topology for...
Given a multilayer routing area, we consider the global routing problem of selecting a maximum set o...
With the exponential reduction in the scaling of feature size, inter-wire coupling capacitance becom...