This paper describes an ASIC yield model based on the CMOS bridge fault model. The model predicts defect sensitive area early in the design cycle as a function of number of gates and nets. 1 INTRODUCTION The semiconductor industry has continuously been looking for ways to improve yield and reduce manufacturing cost. Although chip yield is the key element of IC manufacturing economics, the estimation of yield early in the design cycle still remains a challenging problem. Early prediction of yield is important for costing and capacity estimations. An early warning of low yield may trigger design modifications while there is still time, thus meeting the cost and quality goals. Previous research proposed various IC yield models, and Cunningha...
In order to set up a semiconductor yield model, one should consider defect density variations not on...
This paper presents a revised model for the yield analysis of FPGA interconnect layers. Based on pro...
A procedure for yield prediction and reliability estimation for microlectronic circuit manufacturing...
Spot defects represent the main challenge for enhancement of semiconductor manufacturing yield. As a...
Spot defects represent the main challenge for enhancement of semiconductor manufacturing yield. As a...
Random yield loss is the most significant factor affecting semiconductor manufacturing yield. Random...
Due to the character of the original source materials and the nature of batch digitization, quality ...
Accurate yield prediction to evaluate productivity, and to estimate production costs, is a critical ...
This paper proposes a test cost prediction model which estimates the cost of IC testing in a manufac...
This paper describes the analysis of the influence of yield loss model parameters on the calculation...
Any manufacturing process has natural variations, even when it remains within its control limits. In...
A yield model was developed allowing the calculation of yield using defect density data of manufactu...
The manufacturing of integrated circuits is not a perfect fault-free process. The constant downscali...
In this chapter, we are going to discuss yield loss mechanisms, yield analysis and common physical d...
Interaction between the manufacturing process and the circuit has become a major source of the yield...
In order to set up a semiconductor yield model, one should consider defect density variations not on...
This paper presents a revised model for the yield analysis of FPGA interconnect layers. Based on pro...
A procedure for yield prediction and reliability estimation for microlectronic circuit manufacturing...
Spot defects represent the main challenge for enhancement of semiconductor manufacturing yield. As a...
Spot defects represent the main challenge for enhancement of semiconductor manufacturing yield. As a...
Random yield loss is the most significant factor affecting semiconductor manufacturing yield. Random...
Due to the character of the original source materials and the nature of batch digitization, quality ...
Accurate yield prediction to evaluate productivity, and to estimate production costs, is a critical ...
This paper proposes a test cost prediction model which estimates the cost of IC testing in a manufac...
This paper describes the analysis of the influence of yield loss model parameters on the calculation...
Any manufacturing process has natural variations, even when it remains within its control limits. In...
A yield model was developed allowing the calculation of yield using defect density data of manufactu...
The manufacturing of integrated circuits is not a perfect fault-free process. The constant downscali...
In this chapter, we are going to discuss yield loss mechanisms, yield analysis and common physical d...
Interaction between the manufacturing process and the circuit has become a major source of the yield...
In order to set up a semiconductor yield model, one should consider defect density variations not on...
This paper presents a revised model for the yield analysis of FPGA interconnect layers. Based on pro...
A procedure for yield prediction and reliability estimation for microlectronic circuit manufacturing...