A microprocessor integrated with DRAM on the same die has the potential to improve system performance by reducing the memory latency and improving the memory bandwidth. However, a high performance microprocessor will typically send more accesses than the DRAM can handle due to the long cycle time of the embedded DRAM, especially in applications with significant memory requirements. A multi-bank DRAM can hide the long cycle time by allowing the DRAM to process multiple accesses in parallel, but it will incur a significant area penalty and will therefore restrict the density of the embedded DRAM main memory. In this paper, we propose a hierarchical multibank DRAM architecture to achieve high system performance with a minimal area penalty. In ...
Die-stacking is a new technology that allows multiple integrated circuits to be stacked on top of ea...
Given a fixed CPU architecture and a fixed DRAM timing specification, there is still a large design ...
The capacity and cost-per-bit of DRAM have historically scaled to satisfy the needs of increasingly ...
A microprocessor integrated with DRAM on the same die has the potential to improve system performanc...
A microprocessor integrated with DRAM on the same die has the potential to improve system performanc...
A microprocessor integrated with DRAM on the same die has the potential to improve system performanc...
Abstract—DRAM system has been more and more critical on modern multi-core/many-core architecture whe...
The twin demands of energy-efficiency and higher performance on DRAM are highly emphasized in multic...
In an extensively data-driven and technology-centric world, there has presently been a high demand f...
Modern DRAMs have multiple banks to serve multiple memory requests in parallel. However, when two re...
textContemporary DRAM systems have maintained impressive scaling by managing a careful balance betwe...
Advancements in packaging technology enable high-bandwidth 3D-DRAM that mitigates the memory bandwid...
This paper presents the architecture of a high-performance intermediate-level memory subsystem. The ...
We evaluate the performance of a single chip multiprocessor integrated with DRAM. We compare the per...
Multiple-channel die-stacked DRAMs have been used for maximizing the performance and minimizing the ...
Die-stacking is a new technology that allows multiple integrated circuits to be stacked on top of ea...
Given a fixed CPU architecture and a fixed DRAM timing specification, there is still a large design ...
The capacity and cost-per-bit of DRAM have historically scaled to satisfy the needs of increasingly ...
A microprocessor integrated with DRAM on the same die has the potential to improve system performanc...
A microprocessor integrated with DRAM on the same die has the potential to improve system performanc...
A microprocessor integrated with DRAM on the same die has the potential to improve system performanc...
Abstract—DRAM system has been more and more critical on modern multi-core/many-core architecture whe...
The twin demands of energy-efficiency and higher performance on DRAM are highly emphasized in multic...
In an extensively data-driven and technology-centric world, there has presently been a high demand f...
Modern DRAMs have multiple banks to serve multiple memory requests in parallel. However, when two re...
textContemporary DRAM systems have maintained impressive scaling by managing a careful balance betwe...
Advancements in packaging technology enable high-bandwidth 3D-DRAM that mitigates the memory bandwid...
This paper presents the architecture of a high-performance intermediate-level memory subsystem. The ...
We evaluate the performance of a single chip multiprocessor integrated with DRAM. We compare the per...
Multiple-channel die-stacked DRAMs have been used for maximizing the performance and minimizing the ...
Die-stacking is a new technology that allows multiple integrated circuits to be stacked on top of ea...
Given a fixed CPU architecture and a fixed DRAM timing specification, there is still a large design ...
The capacity and cost-per-bit of DRAM have historically scaled to satisfy the needs of increasingly ...