In this paper we describe the application of the Boundary Element Method to the layout verification of VLSI Designs. We describe the methods for the calculation of interconnection capacitances and substrate resistances with the use of problem specific Green's functions. Emphasis is on computational efficiency and practical accuracy. The methods are implemented in the layout extractor Space (van der Meijs [1]). INTRODUCTION Designers of modern VLSI circuits rely heavily on layout-to-circuit extractors, which translate a chip layout into an equivalent network suitable for electrical verification of their layouts. Because of the growing influence of parasitic elements, such extractors must be able to model (extract) more and more parasit...
We present a new algorithm to improve the 3D boundary element method (BEM) for capacitance extractio...
We improve the accuracy and speed of boundary element method (BEM) or multipole accelerated BEM for ...
With each new generation of IC process technologies, the impact of manufacturing variability is incr...
In this paper we describe a hybrid element method which combines the boundary element method (BEM) a...
Resistive coupling effects via the substrate may damage circuit behaviour of VLSI chips. In order to...
For submicron integrated circuits, 3D numerical techniques are required to accu-rately compute the v...
In this paper, we will first introduce physical verification of Very Large Scale Integration (VLSI) ...
this paper we present methods to model these effects directly from the layout of a circuit. All meth...
In modern VLSI design it is of vital importance to know the influence of parasitics on the behaviour...
An increasingly urgent topic for the realization of densely packed (mixed signal) integrated circuit...
An increasingly urgent topic for the realization of densely packed (mixed signal) integrated circuit...
Substrate coupling effects in integrated circuits can severely degenerate the performance of these c...
Abstract-A new resistance simulator for extraction of the parasitic parameters from VLSI layout is p...
A 2-D hierarchical field solution method was recently introduced for capacitance extraction for VLSI...
Abstract—Algorithms for the efficient evaluation of sub-strate parasitics in mixed-signal integrated...
We present a new algorithm to improve the 3D boundary element method (BEM) for capacitance extractio...
We improve the accuracy and speed of boundary element method (BEM) or multipole accelerated BEM for ...
With each new generation of IC process technologies, the impact of manufacturing variability is incr...
In this paper we describe a hybrid element method which combines the boundary element method (BEM) a...
Resistive coupling effects via the substrate may damage circuit behaviour of VLSI chips. In order to...
For submicron integrated circuits, 3D numerical techniques are required to accu-rately compute the v...
In this paper, we will first introduce physical verification of Very Large Scale Integration (VLSI) ...
this paper we present methods to model these effects directly from the layout of a circuit. All meth...
In modern VLSI design it is of vital importance to know the influence of parasitics on the behaviour...
An increasingly urgent topic for the realization of densely packed (mixed signal) integrated circuit...
An increasingly urgent topic for the realization of densely packed (mixed signal) integrated circuit...
Substrate coupling effects in integrated circuits can severely degenerate the performance of these c...
Abstract-A new resistance simulator for extraction of the parasitic parameters from VLSI layout is p...
A 2-D hierarchical field solution method was recently introduced for capacitance extraction for VLSI...
Abstract—Algorithms for the efficient evaluation of sub-strate parasitics in mixed-signal integrated...
We present a new algorithm to improve the 3D boundary element method (BEM) for capacitance extractio...
We improve the accuracy and speed of boundary element method (BEM) or multipole accelerated BEM for ...
With each new generation of IC process technologies, the impact of manufacturing variability is incr...