As the semiconductor industry has driven down the minimum feature size to well below 50nm, the mask cost to make devices has skyrocketed. The cost for a full set of masks is estimated to be about $1.5M for 90nm node devices and exceeding $2M for 65nm lithography nodes. According to some estimates, mask writing time goes up as a power of five as feature sizes are decreased below 50nm. In addition, higher complexity of large designs increases the number of design re-spins. The above two factors lead to considerable increase in the nonrecurring engineering cost (NRE) for standard cell ASICs, which has become prohibitively expensive for low to mid volume applications. Field programmable gate array (FPGAs) offer an acceptable solution for fast p...
Includes bibliographical references (page 148)In the earlier generations the main focus was on the t...
This paper is a plea for more Imaginative design of MMIC circuits. A survey of architectural develop...
Lithography has always been the most critical process in integrated circuit (IC) fabrication. Below ...
As the semiconductor industry has driven down the minimum feature size to well below 50nm, the mask ...
As process technology scales, the design effort and Non-Recurring Engineering (NRE) costs associated...
The overall goal of this project is to bring down the fabrication cost for low volume ASICs by intro...
Standard Cell ASICs are well known in the IC industry and have been successfully used over the past ...
During the 1990\u27s the main focus of chip design methodologies was on the timings and area constra...
Includes bibliographical references (pages 51)In today???s technological advancements in VLSI indust...
advance, mask set costs have become prohibitively expensive. Structured application specific integra...
In the semiconductor industry today, ASICs are able to offer 10x-1000x higher energy and area effici...
Modern embedded compute platforms increasingly contain both microprocessors and field-programmable g...
As modern integrated circuit design pushes further into the deep submicron era, the pseudo-random de...
During the 1990\u27s the main focus of chip design methodologies was on the timings and area constra...
Field Programmable Gate Arrays (FPGAs) mitigate many of the problemsencountered with the development...
Includes bibliographical references (page 148)In the earlier generations the main focus was on the t...
This paper is a plea for more Imaginative design of MMIC circuits. A survey of architectural develop...
Lithography has always been the most critical process in integrated circuit (IC) fabrication. Below ...
As the semiconductor industry has driven down the minimum feature size to well below 50nm, the mask ...
As process technology scales, the design effort and Non-Recurring Engineering (NRE) costs associated...
The overall goal of this project is to bring down the fabrication cost for low volume ASICs by intro...
Standard Cell ASICs are well known in the IC industry and have been successfully used over the past ...
During the 1990\u27s the main focus of chip design methodologies was on the timings and area constra...
Includes bibliographical references (pages 51)In today???s technological advancements in VLSI indust...
advance, mask set costs have become prohibitively expensive. Structured application specific integra...
In the semiconductor industry today, ASICs are able to offer 10x-1000x higher energy and area effici...
Modern embedded compute platforms increasingly contain both microprocessors and field-programmable g...
As modern integrated circuit design pushes further into the deep submicron era, the pseudo-random de...
During the 1990\u27s the main focus of chip design methodologies was on the timings and area constra...
Field Programmable Gate Arrays (FPGAs) mitigate many of the problemsencountered with the development...
Includes bibliographical references (page 148)In the earlier generations the main focus was on the t...
This paper is a plea for more Imaginative design of MMIC circuits. A survey of architectural develop...
Lithography has always been the most critical process in integrated circuit (IC) fabrication. Below ...