Experimental values are given of the thermal conductivity and thermoelectric power of n-type silicon doped with phosphorus, antimony or arsenic, containing 4*1019 to 6*1025 m-3 electrons at room temperature, covering the range 4-300 degrees K. A theoretical treatment, using the variational method, suggests that the ratio of phonon drag component of thermoelectric power to thermal conductivity should be independent of carrier concentration, if the latter is not too large. This is verified experimentally; the temperature variation of the ratio is in satisfactory agreement with theory, which also gives the correct order of magnitude for the absolute value
AbstractPoly-Si is a widely used material for thermoelectric devices due to its CMOS compatibility. ...
The thermal conductivity of heavily doped, n-type Si-Ge alloys has been studied from 300 to 1200 K. ...
Silicon, one of the most abundant elements on earth, is a promising candidate for thermoelectric app...
Silicon (Si) has received recent interest for thermoelectric (TE) applications. For all TE materials...
Electron–phonon interaction and electronic thermal conductivity have been investigated in heavily do...
In this paper electrical and thermal conductivity coefficients of heavily doped n-Silicon have been ...
Electron–phonon interaction and electronic thermal conductivity have been investigated in heavily do...
The thermal conductance between electrons and phonons in a solid state system becomes comparatively ...
The thermal conductivity and the thermoelectric power of two dimensional hole and electron gases in ...
In this work, the features of the influence of thermal treatment on the electrical and thermoelectri...
The thermal conductivity and the thermoelectric power of two dimensional hole and electron gases in ...
Diamond-like cubic silicon (d-Si) has become a mainstay material for new energy and modern electroni...
WOS: 000372097300004In this work, a systematic theoretical investigation of thermoelectric propertie...
An original approach to the theoretical calculations of the heat conductivity of crystals based on t...
Experimental results are presented for the thermal conductivity of P-doped Si over the concentration...
AbstractPoly-Si is a widely used material for thermoelectric devices due to its CMOS compatibility. ...
The thermal conductivity of heavily doped, n-type Si-Ge alloys has been studied from 300 to 1200 K. ...
Silicon, one of the most abundant elements on earth, is a promising candidate for thermoelectric app...
Silicon (Si) has received recent interest for thermoelectric (TE) applications. For all TE materials...
Electron–phonon interaction and electronic thermal conductivity have been investigated in heavily do...
In this paper electrical and thermal conductivity coefficients of heavily doped n-Silicon have been ...
Electron–phonon interaction and electronic thermal conductivity have been investigated in heavily do...
The thermal conductance between electrons and phonons in a solid state system becomes comparatively ...
The thermal conductivity and the thermoelectric power of two dimensional hole and electron gases in ...
In this work, the features of the influence of thermal treatment on the electrical and thermoelectri...
The thermal conductivity and the thermoelectric power of two dimensional hole and electron gases in ...
Diamond-like cubic silicon (d-Si) has become a mainstay material for new energy and modern electroni...
WOS: 000372097300004In this work, a systematic theoretical investigation of thermoelectric propertie...
An original approach to the theoretical calculations of the heat conductivity of crystals based on t...
Experimental results are presented for the thermal conductivity of P-doped Si over the concentration...
AbstractPoly-Si is a widely used material for thermoelectric devices due to its CMOS compatibility. ...
The thermal conductivity of heavily doped, n-type Si-Ge alloys has been studied from 300 to 1200 K. ...
Silicon, one of the most abundant elements on earth, is a promising candidate for thermoelectric app...