Recent decades have seen impressive developments in the field of integratedphotonics. Chips with complex photonic functionality can presently be designedand fabricated. Photonic packages consist of one or more PICs, as well as other(micro-optical) components, and a fibre (array) to establish the external opticalinterface. A core challenge is the assembly and packaging of these complexdevices, involving sub-μm alignment of components. To overcome thelimitations in multi-chip photonic packaging, a concept is proposed which useson-chip actuators for the fine-alignment of flexible waveguide structures.Micro and Nano Engineerin
Fully automated, high precision, cost-effective assembly technology for photonic packages remains on...
Fully automated, high precision, cost-effective assembly technology for photonic packages remains on...
Photonic packaging, which includes high-precision assembly of photonic sub-systems, is currently a b...
This paper reports on the progress related to a multichannel photonic alignment concept, aiming for ...
<p>This paper reports on the progress related to a multichannel photonic alignment concept, aiming f...
This paper presents a new alignment concept for the alignment of multichannel photonic intergrated c...
This paper presents a new alignment concept for the alignment of multichannel photonic intergrated c...
In this paper, we present positionable photonic waveguide arrays that are developed for optical chip...
THIS thesis describes the development of a positionable waveguide array realized in a silicon nitrid...
THIS thesis describes the development of a positionable waveguide array realized in a silicon nitrid...
Fully automated, high precision, cost-effective assembly technology for photonic packages remains on...
Fully automated, high precision, cost-effective assembly technology for photonic packages remains on...
Fully automated, high precision, cost-effective assembly technology for photonic packages remains on...
Photonic packaging, which includes high-precision assembly of photonic sub-systems, is currently a b...
Fully automated, high precision, cost-effective assembly technology for photonic packages remains on...
Fully automated, high precision, cost-effective assembly technology for photonic packages remains on...
Fully automated, high precision, cost-effective assembly technology for photonic packages remains on...
Photonic packaging, which includes high-precision assembly of photonic sub-systems, is currently a b...
This paper reports on the progress related to a multichannel photonic alignment concept, aiming for ...
<p>This paper reports on the progress related to a multichannel photonic alignment concept, aiming f...
This paper presents a new alignment concept for the alignment of multichannel photonic intergrated c...
This paper presents a new alignment concept for the alignment of multichannel photonic intergrated c...
In this paper, we present positionable photonic waveguide arrays that are developed for optical chip...
THIS thesis describes the development of a positionable waveguide array realized in a silicon nitrid...
THIS thesis describes the development of a positionable waveguide array realized in a silicon nitrid...
Fully automated, high precision, cost-effective assembly technology for photonic packages remains on...
Fully automated, high precision, cost-effective assembly technology for photonic packages remains on...
Fully automated, high precision, cost-effective assembly technology for photonic packages remains on...
Photonic packaging, which includes high-precision assembly of photonic sub-systems, is currently a b...
Fully automated, high precision, cost-effective assembly technology for photonic packages remains on...
Fully automated, high precision, cost-effective assembly technology for photonic packages remains on...
Fully automated, high precision, cost-effective assembly technology for photonic packages remains on...
Photonic packaging, which includes high-precision assembly of photonic sub-systems, is currently a b...